Development of 3D silicon module with TSV for system in packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 550-555

  Khan, Navas ^a   Rao, Vempati Srinivasa ^a   Lim, Samule ^a   We, Ho Soon ^a   Lee, Vincent ^a   Wu, Zhang Xiao ^a   Rui, Yang ^a   Ebin, Liao ^a   Ranganathan, ^a   Chai, T C ^a   Kripesh, V ^a   Lau, John ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CIVIL AVIATION; COMPUTER NETWORKS; COPPER; DIGITAL ARITHMETIC; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FLUID MECHANICS;

SILICON CARRIERS; SYSTEM IN PACKAGING; THROUGH SILICON VIA;

SILICON;

EID: 51349164996     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550027     Document Type: Conference Paper

References (7)

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