SCOPUS 정보 검색 플랫폼

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 309-315

Wafer level embedded system in package (WL-eSiP) for mobile applications

(5) Kang, In Soo a Jung, Gi Jo a Jeon, Byoung Yool a Yoo, Jae Hyouk a Jeong, Seong Hun a

a NEPES Corporation (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BALL MOUNTING; BOARD-LEVEL RELIABILITY; CHIP SIZES; CURVATURE EVALUATION; DIE SIZE; ELECTRONICS MARKETS; FLIP-CHIP BONDING; HIGH ASPECT RATIO; MANUFACTURING PROCESS; MAXIMUM STRESS; MOBILE APPLICATIONS; MOBILE PHONE APPLICATIONS; MOLD MATERIALS; MOLDING COMPOUND; ON-WAFER; PACKAGE LEVELS; PACKAGE RELIABILITY; PROCESS STEPS; RELIABILITY EVALUATION; RELIABILITY TEST; STRESS SIMULATIONS; SYSTEM IN PACKAGE TECHNOLOGIES; TEST VEHICLE; WAFER LEVEL; WARPAGES;

ASPECT RATIO; AUTOMOBILE ELECTRONIC EQUIPMENT; DIELECTRIC MATERIALS; DIES; EMBEDDED SYSTEMS; FABRICATION; FLIP CHIP DEVICES; INTERNET PROTOCOLS; MOLDING; MOLDS; OPTIMIZATION; PACKAGING; RELIABILITY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; TECHNOLOGY; TELECOMMUNICATION EQUIPMENT; TELEPHONE SYSTEMS; THERMAL CONDUCTIVITY;

WAFER BONDING;

EID: 77955198283 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2010.5490956 Document Type: Conference Paper

Times cited : (12)

References (7)

1
- 35348921121
- The redistributed chip package: A breakthrough for advanced packaging
- Reno, NV, May
- th Electronic Components and Technology Conference, Reno, NV, May 2007, p286-291
- (2007) th Electronic Components and Technology Conference , pp. 286-291
- Keser, B.¹ Arnrine, C.²

2
- 63049131136
- Embedded wafer level ball grid array (eWLB)
- Singapore, Dec.
- th Electronics Packaging Technology Conference, Singapore, Dec. 2008, p994-998
- (2008) th Electronics Packaging Technology Conference , pp. 994-998
- Meyer, T.¹ Ofner, G.²

3
- 70349666681
- Embedded wafer level packages with laterally placed and vertically stacked thin dies
- San Diego, CA, May
- th Electronic Components and Technology Conference, San Diego, CA, May 2009, p1537-1543
- (2009) th Electronic Components and Technology Conference , pp. 1537-1543
- Sharma, S.¹ Rao, V.S.²

4
- 77955217732
- Development of wafer level package of normal and high pin count devices for mobile applications
- Santa Clara, CA, Oct.
- th International Wafer Level Packaging Conference, Santa Clara, CA, Oct. 2009, p23-30
- (2009) th International Wafer Level Packaging Conference , pp. 23-30
- Kang, I.-S.¹ Jung, G.J.²

5
- 77950928428
- Structure and process development of wafer level embedded sip for mobile applications
- Singapore, Dec.
- Gi-Jo Jung, et al., "Structure and Process Development of wafer level embedded SiP for mobile applications", Proc. IEEE 11th Electronics Packaging Technology Conference, Singapore, Dec. 2009, p191-196
- (2009) th Electronics Packaging Technology Conference , pp. 191-196
- Jung, G.-J.¹

6
- 35348870992
- Chip embedded wafer level packaging technology for stacked RF-SiP application
- Reno, NV, May
- Cien-Wei Chien, Li-Cheng Shen, et al., "Chip Embedded Wafer Level Packaging Technology for Stacked RF-SiP Application, " Proc. 57th Electronic Components and Technology Conference, Reno, NV, May 2007, p305-310
- (2007) th Electronic Components and Technology Conference , pp. 305-310
- Chien, C.-W.¹ Shen, L.-C.²

7
- 70349659174
- Wafer level embedded technology for 3D wafer level embedded package
- San Diego, CA, May
- Aditya Kumar, Xia Dingwei, at al., "Wafer Level Embedded Technology for 3D Wafer Level Embedded Package, " Proc. 59th Electronic Components and Technology Conference, San Diego, CA, May 2009, p1289-1296
- (2009) th Electronic Components and Technology Conference , pp. 1289-1296
- Kumar, A.¹ Dingwei, X.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.