Design and reliability analysis of pyramidal shape 3-layer stacked TSV die package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1428-1435

  Che, F X ^a   Chai, T C ^a   Lim, Sharon P S ^a   Rajoo, Ranjan ^a   Zhang, Xiaowu ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BEND TEST; BENDING FORCE; DIE CRACKS; DIE PACKAGES; DIE STACK; DIE STACKING; DIE STRENGTH; DIE STRESS; FEA SIMULATION; LAYOUT DESIGNS; MICRO-BUMPS; NEW DESIGN; PYRAMIDAL SHAPE; SOLDER REFLOW; WARPAGES;

CHIP SCALE PACKAGES; CRACKS; DESIGN; EXPERIMENTS; FINITE ELEMENT METHOD; OPTIMIZATION; RELIABILITY ANALYSIS; SOLDERING;

DIES;

EID: 79960406322     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898699     Document Type: Conference Paper

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