Electro- and thermomigration in micro bump interconnects for 3D integration

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1444-1451

  Meinshausen, L ^a   Weide Zaage, K ^a   Petzold, M ^b  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; AGING PROCESS; CHIP-ON-CHIP; CONTACT SURFACE; CURRENT CROWDING; EXPECTED LIFETIME; FEM MODELS; FINE PITCH; HIGH CURRENT DENSITIES; LOW MELTING; MATERIAL TRANSPORT; MICRO-BUMPS; MOBILE ELECTRONICS; SIMULATION RESULT; SOLDER MATERIAL; THERMOMIGRATION;

CHIP SCALE PACKAGES; COMPUTER SIMULATION;

BALL GRID ARRAYS;

EID: 79960411498     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898701     Document Type: Conference Paper

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