Wafer and/or chip bonding adhesives for 3D package

2010 IEEE CPMT Symposium Japan, ICSJ10

Volumn , Issue , 2010, Pages

  Nonaka, Toshihisa ^a   Fujimaru, Koichi ^a   Shimada, Akira ^a   Asahi, Noboru ^a   Tatsuta, Yoshiko ^a   Niwa, Hiroyuki ^a   Tachibana, Yasuko ^a  

^a TORAY INDUSTRIES INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D PACKAGES; ALIGNMENT MARKS; BONDING PROCESS; CHIP BONDING; CONDUCTIVE SHEET; FLOWABILITY; HIGH HEAT RESISTANCE; LOW COEFFICIENT OF THERMAL EXPANSIONS; THERMAL CYCLE; WAFER LEVEL PROCESS; WAFER SURFACE; WEIGHT LOSS TEMPERATURES;

ALIGNMENT; HEAT RESISTANCE; LAMINATING; PHOTOLITHOGRAPHY; THERMAL EXPANSION; THREE DIMENSIONAL;

WAFER BONDING;

EID: 79251564471     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CPMTSYMPJ.2010.5679534     Document Type: Conference Paper

References (2)

1. th Electronic Components and Technology Conf, Orlando, FL, May. 2008, pp. 1550-1555.
2. Bohren, C.F. and Huffman, D.R., "Absorption and Scattering of Light by Small Particles," John Wiley & Sons, 1983.