Failure mechanism of 20μm pitch microjoint within a chip stacking architecture

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 886-892

  Huang, Shin Yi ^a   Chang, Tao Chih ^a   Cheng, Ren Shin ^a   Chang, Jing Yao ^a   Fan, Chia Wen ^a   Zhan, Chau Jie ^a   Lau, John H ^a   Chen, Tai Hong ^a   Lo, Wei Chung ^a   Kao, Ming Jer ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP STACKING; CROSS SECTIONAL IMAGE; CU PILLAR; DEPLETION ZONES; ELECTRONIC MICROSCOPES; ELEMENTAL DISTRIBUTION; ENERGY DISPERSIVE SPECTROMETERS; FAILURE MECHANISM; FAILURE RATE; GAP WIDTHS; INTERFACIAL FRACTURE; INTERMETALLIC PHASE; LIFE SPAN; MAPPING ANALYSIS; MICRO-BUMPS; MICRO-JOINT; MICROGAPS; NEW DESIGN; PEAK TEMPERATURES; SCANNING ACOUSTIC MICROSCOPES; SEED LAYER; SOLDER ALLOYS; SOLID-SOLID; TEMPERATURE CYCLING TESTS; TEST CONDITION; TEST RESULTS; UNDERFILL MATERIALS; UNDERFILLS;

ACOUSTIC MICROSCOPES; DEFECTS; GROWTH KINETICS; PHASE INTERFACES; THERMAL EXPANSION; TIN;

FRACTURE;

EID: 79960404256     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898616     Document Type: Conference Paper

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