Ceramics vs. low-CTE organic packaging of TSV silicon interposers

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 573-576

  Banijamali, Bahareh ^a   Ramalingam, Suresh ^a   Kim, Namhoon ^a   Wyland, Chris ^a  

^a XILINX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOARD-LEVEL RELIABILITY; CORE MATERIAL; DIE STRESS; LOWER COST; LTCC (LOW TEMPERATURE CO-FIRED CERAMIC); LTCC-CERAMICS; MARKET ACCEPTANCE; MICRO-BUMPS; ORGANIC MATERIALS; ORGANIC PACKAGING; PACKAGE SIZE; SECOND LEVEL; SIMULATION RESULT; THROUGH-SILICON-VIA; WIRING DENSITY;

COREMAKING; DIES; ELECTRONICS PACKAGING; PACKAGING MATERIALS; RELIABILITY; STRESSES;

CERAMIC MATERIALS;

EID: 79960387923     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898569     Document Type: Conference Paper

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