Structure and properties of lead-free solders bearing micro and nano particles

Materials Science and Engineering R: Reports

Volumn 82, Issue 1, 2014, Pages 1-32

  Zhang, Liang ^a   Tu, K N ^b  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Creep; Intermetallic compounds; Lead free solders; Nano particles

Indexed keywords

BINARY ALLOYS; COARSENING; COPPER ALLOYS; CREEP; CREEP RESISTANCE; DISPERSION HARDENING; DRAG; GRAIN BOUNDARIES; INTERMETALLICS; NANOPARTICLES; SILVER ALLOYS; THREE DIMENSIONAL INTEGRATED CIRCUITS; TIN ALLOYS;

COMPOSITE LEAD-FREE SOLDERS; COMPOSITE SOLDERS; IC TECHNOLOGY; MICRO AND NANO-PARTICLE; MICRO-BUMPS; SOLDER MICROSTRUCTURE; STRUCTURE AND PROPERTIES; SYSTEMATIC REVIEW;

LEAD-FREE SOLDERS;

EID: 84903635425     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mser.2014.06.001     Document Type: Review

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