Mechanical properties of Sn-0.7Cu/Si3N4 lead-free composite solder

Materials Science and Engineering: A

Volumn 556, Issue , 2012, Pages 633-637

  Mohd Salleh, M A A ^a   Bakri, A M Mustafa Al ^a   Zan Hazizi, M H ^a   Somidin, Flora ^a   Mohd Alui, Noor Farhani ^b   Ahmad, Zainal Arifin ^c  

^a UNIVERSITY MALAYSIA PERLIS   (Malaysia)

^b Politeknik Tuanku Syed Sirajuddin   (Malaysia)

^c SCHOOL OF PHYSICS   (Malaysia)

Author keywords

Composite; Lead free solder; Powder metallurgy; Silicon nitride

Indexed keywords

BINARY ALLOYS; DUCTILE FRACTURE; LEAD-FREE SOLDERS; MELTING POINT; MICROHARDNESS; POWDER METALLURGY; REINFORCEMENT; TIN ALLOYS;

CERAMIC PARTICULATES; COMPOSITE SOLDERS; HIGH PERFORMANCE CERAMICS; LAP SHEAR STRENGTH; LEAD-FREE; MELTING POINT TEMPERATURE; MONOLITHICS; PARTICULATES; SERVICE TEMPERATURE; SN-0.7CU;

SILICON NITRIDE;

EID: 84865438024     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.07.039     Document Type: Article

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