Interfacial intermetallic growth and shear strength of lead-free composite solder joints

Journal of Alloys and Compounds

Volumn 473, Issue 1-2, 2009, Pages 100-106

  Nai, S M L ^a   Wei, J ^b   Gupta, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Intermetallics; Mechanical properties; Metal matrix composites; Scanning electron microscopy

Indexed keywords

BRAZING; CARBON NANOTUBES; LEAD; MECHANICAL PROPERTIES; METALLIC MATRIX COMPOSITES; SCANNING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; TIN; WELDING;

AGING TIME; COMPOSITE SOLDERS; DIFFUSION COEFFICIENTS; IMC LAYERS; IMC THICKNESS; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUNDS; ISOTHERMAL AGING; LEAD-FREE; METAL MATRIX COMPOSITES; MONOLITHIC COUNTERPARTS; SHEAR TESTS; SN-AG-CU SOLDERS; SOLDER JOINTS; WEIGHT PERCENTAGES;

SOLDERING ALLOYS;

EID: 61449215388     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.05.070     Document Type: Article

References (40)

1. Bae K.S., and Kim S.J. J. Electron. Mater. 30 (2001) 1452-1457
2. Subramanian K.N., Bieler T.R., and Lucas J.P. J. Electron. Mater. 28 (1999) 1176-1183
3. Choi S., Lee J.G., Guo F., Bieler T.R., Subramanian K.N., and Lucas J.P. J. Miner. Met. Mater. Soc. 53 (2001) 22-26
4. Zhong X.L., and Gupta M. Adv. Eng. Mater. 7 (2005) 1049-1054
5. Mavoori H., and Jin S. JOM June (2000) 30-32
6. Tai F., Guo F., Xia Z.D., Lei Y.P., Yan Y.F., Liu J.P., and Shi Y.W. J. Electron. Mater. 34 (2005) 1357-1362
7. Nai S.M.L., Wei J., and Gupta M. J. Electron. Mater. 35 (2006) 1518-1522
8. Nai S.M.L., Wei J., and Gupta M. Proceedings of the ASME IMECE, International Mechanical Engineering Congress and Exposition. USA, November (2006)
9. Nai S.M.L., Wei J., and Gupta M. Thin Solid Films 504 (2006) 401-404
10. Nai S.M.L., Wei J., and Gupta M. Solid State Phenomena 111 (2006) 59-62
11. Nai S.M.L., Wei J., and Gupta M. Proceedings of the ASME IMECE on Electronic and Photonic Packaging, Integration and Packaging of Micro/nano/electronic Systems. USA (2005) 295
12. Guo F., Choi S., Lucas J.P., and Subramanian K.N. Soldering Surf. Mount Technol. 13 (2001) 7-18
13. Kao S.T., Lin Y.C., and Duh J.G. J. Electron. Mater. 35 (2006) 486-493
14. Guo F., Lee J., Choi S., Lucas J.P., Bieler T.R., and Subramanian K.N. J. Electron. Mater. 30 (2001) 1073-1082
15. Lee J.G., Chen K.C., and Subramanian K.N. J. Electron. Mater. 32 (2003) 1240-1248
16. Wu Y.J., Sees J.A., Pouraghabagher C., Foster L.A., Marshall J.L., Jacobs E.G., and Pinizzoto R.F. J. Electron. Mater. 22 (1993) 769-777
17. Ahat S., Sheng M., and Luo L. J. Electron. Mater. 30 (2001) 1317-1322
18. Ho C.E., Tsai S.Y., and Cao C.R. IEEE Trans. Adv. Pack. 24 (2001) 493-498
19. Xu L.H., Pang J.H.L., Prakash K.H., and Low T.H. IEEE Trans. Compon. Pack. Technol. 28 (2005) 408-414
20. S.L. Ngoh, Ph.D. Thesis, Nanyang Technological University, 2005.
21. Chen S.W., Wu S.H., and Lee S.W. J. Electron. Mater. 32 (2003) 1188-1194
22. Lin C.H., Chen S.W., and Wang C.H. J. Electron. Mater. 31 (2002) 907-915
23. Yoon J.W., and Jung S.B. J. Mater. Sci. 39 (2004) 4211-4217
24. Zribi A., Clark A., Zavalij L., Borgesen P., and Cotts E.J. J. Electron. Mater. 30 (2001) 1157-1164
25. Yoon J.W., Lee C.Y., Lee C.B., Yoo C.S., and Jung S.B. Zeitschrift Fur Metallkunde 94 (2003) 453
26. Choi S., Lucas J.P., Subramanian K.N., and Bieler T.R. J. Mater. Sci.: Mater. Electron. 11 (2000) 497-502
27. Lee T.Y., Choi W.J., Tu K.N., Jang J.W., Kuo S.M., Lin J.K., Frear D.R., Zeng K., and Kivilahti J.K. J. Mater. Res. 17 (2002) 291-301
28. Huang C.S., Jang G.Y., and Duh J.G. J. Mater. Res. 18 (2003) 935-940
29. Tu K.N., Gusak A.M., and Li M. J. Appl. Phys. 93 (2003) 1335-1353
30. Clyne T.W., and Withers P.J. An Introduction to Metal Matrix Composites (1993), Cambridge University Press, Cambridge
31. Dai L.H., Ling Z., and Bai Y.L. Compos. Sci. Technol. 61 (2001) 1057-1063
32. Nardone V.C., and Prewo K.M. Scripta Metall. 20 (1986) 43-48
33. Ryu H.J., Cha S.I., and Hong S.H. J. Mater. Res. 18 (2003) 2851-2853
34. Zhang Z., and Chen D.L. Scripta Mater 54 (2006) 1321-1326
35. Deng X., Shidhu R.S., Johnson P., and Chawla N. Metall. Mater. Trans. A 36 (2005) 55-64
36. Lee Y.H., and Lee H.T. Mater. Sci. Eng. A 444 (2007) 75-83
37. Yoon J.W., and Jung S.B. J. Mater. Res. 2 (2006) 1590-1599
38. Lee H.T., Chen M.H., Jao H.M., and Liao T.L. Mater. Sci. Eng. A 358 (2003) 134-141
39. Kim K.S., Huh S.H., and Suganuma K. J. Alloys Compd. 352 (2003) 226-236
40. Yoon J.W., Kim S.W., and Jung S.B. J. Alloys Compd. 391 (2005) 82-89