Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder

Materials and Design

Volumn 32, Issue 10, 2011, Pages 4720-4727

  Chang, S Y ^a   Jain, C C ^b   Chuang, T H ^b   Feng, L P ^c   Tsao, L C ^c  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^c NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

A. Non ferros metals and alloys; D. Brazing and soldering; F. Microstructure

Indexed keywords

COMPOSITE SOLDERS; D. BRAZING AND SOLDERING; DISPERSION STRENGTHENING; EFFECT OF ADDITION; F. MICROSTRUCTURE; IMC LAYER; LEAD-FREE; LEAD-FREE SOLDER JOINT; MELTING PROPERTIES; METALS AND ALLOYS; NANOPARTICLE ADDITION; SN-3.5AG; TIO;

INTERMETALLICS; LEAD COMPOUNDS; METALLURGY; MICROHARDNESS; MICROSTRUCTURE; NANOCOMPOSITE FILMS; NANOPARTICLES; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TITANIUM DIOXIDE;

TIN;

EID: 79960899812     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.06.044     Document Type: Article

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