SCOPUS 정보 검색 플랫폼

Volumn 470, Issue 1-2, 2009, Pages 188-194

Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes

(3) Liu, Ping a,b Yao, Pei a,c Liu, Jim b

a TIANJIN UNIVERSITY (China)

b Motorola China Research Center (China)

c UNIVERSITY OF WOLLONGONG (Australia)

Author keywords

Intermetallics (IM); Kinetics; Liquid solid reactions; Microstructure; Scanning electron microscopy (SEM)

Indexed keywords

BRAZING; COPPER; DIFFUSION; DUCTILE FRACTURE; ELECTRON MICROSCOPY; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; GROWTH (MATERIALS); GROWTH KINETICS; INTERMETALLICS; MICROSTRUCTURE; NICKEL; ORE TREATMENT; POLYCHLORINATED BIPHENYLS; SCANNING; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING ALLOYS; STRENGTH OF MATERIALS; SUBSTRATES; TIN; WELDING;

DIFFUSION CONTROLS; GRAIN-BOUNDARY DIFFUSIONS; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; INTERMETALLICS (IM); KINETICS; LIQUID-SOLID REACTIONS; ORGANIC SOLDERABILITY PRESERVATIVES; PCB SURFACE FINISHES; SCANNING ELECTRON MICROSCOPY (SEM); SHEAR FORCES; SHEAR TESTS; SN-37PB; SN-PB SOLDERS; SOLDER JOINTS; VOLUME DIFFUSIONS;

SEMICONDUCTING INTERMETALLICS;

EID: 59249099111 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2008.02.102 Document Type: Article

Times cited : (82)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.