SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 6, 2009, Pages 571-576

Development of lead-free Sn-3.5Ag/SnO 2 nanocomposite solders

(3) Babaghorbani, P a Nai, S M L a Gupta, M a

a NATIONAL UNIVERSITY OF SINGAPORE (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY-EFFICIENT; LEAD-FREE; MICROWAVE ASSISTED; NANOCOMPOSITE SOLDERS; NANOMETER LENGTH SCALE; SOLDER MATRIXES;

BRAZING; ENERGY EFFICIENCY; MECHANICAL PROPERTIES; METALLURGY; REINFORCEMENT; SILVER; SOLDERING ALLOYS; WELDING;

TIN;

EID: 62249114930 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-008-9767-1 Document Type: Article

Times cited : (55)

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