메뉴 건너뛰기




Volumn 30, Issue 8, 2012, Pages 790-793

Microstructures and properties of SnZn-xEr lead-free solders

Author keywords

Lead free solders; Mechanical properties; Oxidation resistance; Rare earths; Solder joints

Indexed keywords

ERBIUM; ERBIUM COMPOUNDS; EUTECTICS; MECHANICAL PROPERTIES; MECHANICAL TESTING; MICROSTRUCTURE; OXIDATION RESISTANCE; RARE EARTH ALLOYS; RARE EARTHS; SOLDERING ALLOYS; TENSILE TESTING;

EID: 84872159275     PISSN: 10020721     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1002-0721(12)60131-8     Document Type: Article
Times cited : (36)

References (20)
  • 3
    • 77954091045 scopus 로고    scopus 로고
    • Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies
    • Dompierre B, Aubin V, Charkaluk E, Filho W C M, Brizoux M. Influence of thermal ageing on cyclic mechanical properties of SnAgCu alloys for microelectronic assemblies. Proce-dia Engineering, 2010, 2(1): 1477.
    • (2010) Proce-dia Engineering , vol.2 , Issue.1 , pp. 1477
    • Dompierre, B.1    Aubin, V.2    Charkaluk, E.3    Filho, W.C.M.4    Brizoux, M.5
  • 4
    • 84863125803 scopus 로고    scopus 로고
    • Effects of addition of rare earth element Nd on properties of Sn-9Zn lead-free solder
    • Hu Y H, Xue S B, Liu M, Xu H. Effects of addition of rare earth element Nd on properties of Sn-9Zn lead-free solder. Transactions of the China Welding Institution, 2012, 33(1): 85.
    • (2012) Transactions of the China Welding Institution , vol.33 , Issue.1 , pp. 85
    • Hu, Y.H.1    Xue, S.B.2    Liu, M.3    Xu, H.4
  • 5
    • 72649098212 scopus 로고    scopus 로고
    • The effect of 0.5% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads
    • Lin H J, Chuang T H. The effect of 0.5% Ce additions on the electromigration of Sn9Zn BGA solder packages with Au/Ni(P)/Cu and Ag/Cu pads. Materials Letters, 2010, 64(4): 506.
    • (2010) Materials Letters , vol.64 , Issue.4 , pp. 506
    • Lin, H.J.1    Chuang, T.H.2
  • 6
    • 72749114030 scopus 로고    scopus 로고
    • Wetting properties and interfacial microstructures of Sn-Zn-xGa solders on Cu substrate
    • Chen W X, Xue S B, Wang H. Wetting properties and interfacial microstructures of Sn-Zn-xGa solders on Cu substrate. Materials & Design, 2010, 31(4): 2196.
    • (2010) Materials & Design , vol.31 , Issue.4 , pp. 2196
    • Chen, W.X.1    Xue, S.B.2    Wang, H.3
  • 7
    • 44449091936 scopus 로고    scopus 로고
    • Study on the properties of Sn-9Zn-xCr lead-free solder
    • Chen X, Hu A M, Li M, Mao D L. Study on the properties of Sn-9Zn-xCr lead-free solder. Journal of Alloys and Compounds, 2008, 460(1-2): 478.
    • (2008) Journal of Alloys and Compounds , vol.460 , Issue.1-2 , pp. 478
    • Chen, X.1    Hu, A.M.2    Li, M.3    Mao, D.L.4
  • 8
  • 12
    • 34547410784 scopus 로고    scopus 로고
    • Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element y additions
    • Hao H, Tian J, Shi Y W, Lei Y P, Xia Z D. Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions. Journal of Electronic Materials, 2007, 36(7): 766.
    • (2007) Journal of Electronic Materials , vol.36 , Issue.7 , pp. 766
    • Hao, H.1    Tian, J.2    Shi, Y.W.3    Lei, Y.P.4    Xia, Z.D.5
  • 13
    • 56849085502 scopus 로고    scopus 로고
    • Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints
    • Wang J X, Xue S B, Han Z J, Yu S L, Chen Y, Shi Y P, Wang H. Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints. Journal of Alloys and Compounds, 2009, 467(1-2): 219.
    • (2009) Journal of Alloys and Compounds , vol.467 , Issue.1-2 , pp. 219
    • Wang, J.X.1    Xue, S.B.2    Han, Z.J.3    Yu, S.L.4    Chen, Y.5    Shi, Y.P.6    Wang, H.7
  • 15
    • 45449105560 scopus 로고    scopus 로고
    • Effects of multiple reflows on intermetal-lic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metalized substrate
    • Yao P, Liu P, Liu J. Effects of multiple reflows on intermetal-lic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metalized substrate. Journal of Alloys and Compounds, 2008, 462(1-2): 73.
    • (2008) Journal of Alloys and Compounds , vol.462 , Issue.1-2 , pp. 73
    • Yao, P.1    Liu, P.2    Liu, J.3
  • 16
    • 40349114531 scopus 로고    scopus 로고
    • Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
    • Shi Y W, Tian J, Hao H, Xia Z D, Lei Y P, Guo F. Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder. Journal of Alloys and Compounds, 2008, 453(1-2): 180.
    • (2008) Journal of Alloys and Compounds , vol.453 , Issue.1-2 , pp. 180
    • Shi, Y.W.1    Tian, J.2    Hao, H.3    Xia, Z.D.4    Lei, Y.P.5    Guo, F.6
  • 17
    • 77949487700 scopus 로고    scopus 로고
    • Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy
    • Zou C D, Gao Y L, Yang B, Zhai Q J. Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy. Materials Characterization, 2010, 61(4): 474.
    • (2010) Materials Characterization , vol.61 , Issue.4 , pp. 474
    • Zou, C.D.1    Gao, Y.L.2    Yang, B.3    Zhai, Q.J.4
  • 20
    • 77951867471 scopus 로고    scopus 로고
    • Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
    • Zhang L, Xue S B, Gao L L, Chen Y, Yu S L, Sheng Z, Zeng G. Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium. Soldering & Surface Mount Technology, 2010, 22(2): 30.
    • (2010) Soldering & Surface Mount Technology , vol.22 , Issue.2 , pp. 30
    • Zhang, L.1    Xue, S.B.2    Gao, L.L.3    Chen, Y.4    Yu, S.L.5    Sheng, Z.6    Zeng, G.7


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.