Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions

Journal of Electronic Materials

Volumn 34, Issue 11, 2005, Pages 1357-1362

  Tai, F ^a   Guo, F ^a   Xia, Z D ^a   Lei, Y P ^a   Yan, Y F ^a   Liu, J P ^a   Shi, Y W ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Composite solder; Creep rupture life; Lead free solder; Microstructure; Nanosized; Solderability

Indexed keywords

COPPER; CREEP; DUCTILITY; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; WETTING;

COMPOSITE SOLDER; CREEP-RUPTURELIFE; LEAD-FREE SOLDER; NANOSIZED; SOLDERABILITY;

TIN;

EID: 28044443714     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0190-6     Document Type: Article

References (9)

1. J.L. Marshall, J. Calderon, J. Sees, G. Lucey, and J.S. Hwang, IEEE Trans. Components, Hybrids, Manufact. Technol. 14, 698 (1991).
2. K.N. Subramanian, T.R. Bieler, and J.P Lucas, J. Electron. Mater. 28, 1176 (1999).
3. F. Guo and K.N. Subramanian, Adv. Mater. Proc. 160, 41 (2002).
4. J.P. Liu, F. Guo, Y.F. Yan, W.B. Wang, and Y.W. Shi, J. Electron. Mater. 33, 958 (2004).
5. A.W. Gibson, K.N. Subramanian, and T.R. Bieler, J. Adv. Mater. 30, 19 (1998).
6. H. Mavoori and S. Jin, J. Electron. Mater. 27, 1216 (1998).
7. J.K. Lin, A. DeSilva, D. Frear, Y. Guo, J. Yang, L. Li, D. Mitchell, B. Yeung, and C. Zhang, Proc. 51st ECTC (Piscataway, NJ: IEEE, 2001), pp. 455-462.
8. W.J. Plumbridge, C.R. Gagg, and S. Peter, J. Electron. Mater. 30, 1178 (2002).
9. F. Guo, S. Choi, J.P. Lucas, and K.N. Subramanian, Soldering Surface Mount Technol. 13, 7 (2001).