SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 39, Issue 2, 2010, Pages 215-222

Impression creep of a lead-free Sn-1.7Sb-1.5Ag solder reinforced by submicron-size Al 2O 3 particles

(3) Kangooie, M a Mahmudi, R a Geranmayeh, A R a

a UNIVERSITY OF TEHRAN (Iran)

Author keywords

Composite; Impression creep; Lead free solder

Indexed keywords

APPLIED STRESS; AVERAGE STRESS; AVERAGE VALUES; COMPOSITE SOLDERS; CREEP MECHANISM; DISLOCATION CLIMB; DISLOCATION CORE; DISLOCATION VISCOUS GLIDE; DISPERSIVE DISTRIBUTION; IMPRESSION CREEP; LEAD FREE SOLDERS; LEAD-FREE; MINIMUM CREEP RATES; MONOLITHIC ALLOYS; PIPE DIFFUSION; POWER-LAW RELATIONSHIP; PUNCHING STRESS; SOLDER ALLOYS; STRESS EXPONENTS; SUBMICRON; SUBMICRON-SIZED; VACANCY DIFFUSION;

ACTIVATION ANALYSIS; ACTIVATION ENERGY; ALUMINUM; BLENDING; COMPOSITE MICROMECHANICS; CREEP; INTERMETALLICS; LEAD; METALLURGY; SILVER; SILVER ALLOYS; SINTERING; SOLDERING ALLOYS; TIN; TIN ALLOYS;

CREEP RESISTANCE;

EID: 77951253202 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0971-4 Document Type: Article

Times cited : (26)

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