Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder

Soldering & Surface Mount Technology

Volumn 23, Issue 2, 2011, Pages 68-74

  Nadia, Aemi ^a   Haseeb, A S M A ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

Composite materials; Copper; Mechanical properties of materials; Nanotechnology; Solder

Indexed keywords

COPPER NANOPARTICLES; CU NANOPARTICLES; HOMOGENEOUS MIXTURES; MECHANICAL PROPERTIES OF MATERIALS; MELTING TEMPERATURES; METAL PARTICLE; NANO-CU; NANOCOMPOSITE SOLDER; NON EQUILIBRIUM; PLANETARY BALL MILL; POWDER PARTICLES; PRECISE CONTROL; PROCESSING TECHNIQUE; SN-3.5AG SOLDERS; SN-AG-CU; SOLDER; SOLDER COMPOSITION; STRUCTURE AND PROPERTIES; SUBMICRON; WETTING BEHAVIOUR;

BALL MILLING; BALL MILLS; COMPOSITE MATERIALS; COPPER; MATERIALS PROPERTIES; MECHANICAL PROPERTIES; MILLING (MACHINING); MILLING MACHINES; NANOCOMPOSITES; NANOPARTICLES; NANOTECHNOLOGY; SILVER; SOLDERING ALLOYS;

TIN;

EID: 79955692166     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911111120131     Document Type: Article

References (43)

1. Abtew, M. and Selvaduray, G. (2000), “Lead-free solders in microelectronics”, Materials Science and Engineering, Vol. 27 Nos 5-6, pp. 95-141.
2. Arafat, M. and Haseeb, A.S.M.A. (2009), “Effects of Mo nanopowders on the lead free Sn-3.8Ag-0.7Cu solder”, paper presented at the Conference Advances in Materials and Processing Technologies (AMPT), IIUM, Kuala Lumpur (under reviewed).
3. Chen, Z., Shi, Y., Xia, Z. and Yan, Y. (2003), “Properties of lead-free solder SnAgCu containing minute amounts of rare earth”, Journal of Electronic Materials, Vol. 32 No. 4, pp. 236-43.
4. Choi, W.K., Kim, J.H., Jeong, S.W. and Lee, H.M. (2002), “Interfacial microstructure and joint strength of Sn-3.5Ag-X (X= Cu, In, Ni) solder joint”, Journal Material Research Society, Vol. 17 No. 1, pp. 43-51.
5. Guo, F. (2007), “Composite lead-free electronic solders”, Journal of Material Science: Materials in Electronic, Vol. 18 Nos 1-3, pp. 129-45.
6. Guo, F., Lucas, J.P. and Subramanian, K.N. (2001), “Creep behavior in Cu and Ag particle-reinforced composite and eutectic Sn-3.5Ag and Sn-4.0Ag-0.5Cu non-composite solder joints”, Journal of Materials Science: Materials in Electronics, Vol. 12 No. 1, pp. 27-35.
7. Kao, S.T. and Duh, J.G. (2004), “Effect of Cu concentration on morphology of Sn-Ag-Cu solders by mechanical alloying”, Journal of Electronics Materials, Vol. 33 No. 12, pp. 1445-51.
8. Kao, S.T., Lin, Y.C. and Duh, J.G. (2006), “Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition”, Journal of Electronics Materials, Vol. 35 No. 3, pp. 486-93.
9. Lai, H.L. and Guh, D.H. (2003), “Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying”, Journal of Electronics Materials, Vol. 32 No. 4, pp. 215-20.
10. Lin, D.C., Srivatsan, T.S., Wang, G.X. and Kovacevic, R. (2006), “Microstructural development in a rapidly cooled eutectic Sn-3.5% Ag solder reinforced with copper powder”, Powder Technology, Vol. 166 No. 1, pp. 38-46.
11. Lin, D.C., Srivatsan, T.S., Wang, G.X. and Kovacevic, R. (2007), “Understanding the influence of copper nanoparticles on thermal characteristics and microstructural development of a tin-silver solder”, Journal of Materials Engineering and Performance, Vol. 16 No. 5, pp. 647-54.
12. Lin, D.C., Wang, G.X., Srivatsan, T.S., Al-Hajri, M. and Petraroli, M. (2003), “Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin lead solder”, Materials Letters, Vol. 57 No. 21, pp. 3193-8.
13. Liu, P., Yao, P. and Liu, J. (2008), “Effect of SiC nanoparticle additions on microstructure and microhardness of Sn-Ag-Cu solder alloy”, Journal of Electronics Materials, Vol. 37 No. 6, pp. 874-9.
14. Maveety, J.G., Liu, O., Vijayen, J., Hua, F. and Sanchez, E.A. (2004), “Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders”, Journal of Electronic Materials, Vol. 33 No. 11, pp. 1355-62.
15. Nai, S.M.L., Wei, J. and Gupta, M. (2006), “Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites”, Thin Solid Films, Vol. 504 Nos 1-2, pp. 401-404.
16. Ochoa, F., Williams, J.J. and Chawla, N. (2003), “The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder”, Journal of the Minerals, Metals & Materials Society, Vol. 55 No. 6, pp. 56-60.
17. Pan, J., Toleno, B.J., Chou, T.C. and Dee, W.J. (2006), “The effect of reflow profile on SnPb and SnAgCu solder joint shear strength”, Surface and Mount Technology, Vol. 18 No. 4, pp. 48-56.
18. Plumbridge, W.J. (2005), “Second generation lead-free solder alloys – a challenge to thermodynamics”, Monatshefte für Chemie, Vol. 136 No. 11, pp. 1811-21.
19. Reddy, B., Bhattachary, P. and Singh, B. (2008), “The effect of ball milling on the melting behavior of Sn-Cu-Ag eutectic alloy”, Journal Material Science, Vol. 44 No. 9, pp. 2257-63.
20. Rhee, H., Guo, F., Lee, J.G., Chen, K.C. and Subramanian, K.N. (2003), “Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints”, Journal of Electronic Materials, Vol. 32 No. 11, pp. 1257-64.
21. Richards, B.P. (2002), “Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints”, Journal of Electronic Materials, Vol. 31 No. 10, pp. 1122-8.
22. Rönkä, K. (2001), “Time dependent microstructural and compositional changes at the interfaces between materials in electronics”, Phd thesis, Helsinki University of Technology, Espoo.
23. Shen, J. and Chan, Y.C. (2009), “Research advances in nano-composite solders”, Microelectronics Reliability, Vol. 49 No. 3, pp. 223-34.
24. Tu, K.N., Gusak, A.M. and Li, M. (2003), “Physics and materials challenges for lead-free solders”, Journal of Applied Physics, Vol. 93 No. 3, pp. 1335-52.
25. Vianco, P.T. and Claghorn, A.C. (1996), “Effect of substrate preheating on solderability performance as a guideline for assembly process development Part 1: baseline analysis”, Soldering Surface Mount Technology, Vol. 8 No. 3, pp. 12-18.
26. Vianco, P.T. and Rejent, J.A. (1999), “Properties of ternary Sn-Ag-Bi solder alloys: Part II – wettability and mechanical properties analyses”, Journal of Electronic Materials, Vol. 28 No. 10, pp. 1138-43.
27. Vincent, J.H. and Richards, B.P. (1993), “Alternative solders for electronics assemblies: Part 2: UK progress and preliminary trials”, Circuit World, Vol. 19 No. 3, pp. 32-4.
28. Wu, C.M.L., Yua, D.Q., Law, C.M.T. and Wang, L. (2004), “Properties of lead-free solder alloys with rare earth element additions”, Materials Science and Engineering, Vol. 44 No. 1, pp. 1-44.
29. Yost, R., Romig, A.D., Jaccodine, J.R., Jackson, K.A. and Sundahl, R.C. (1988), “Thermodynamics of wetting by liquids metal”, Electronic Packaging Materials Science II, Material Research Society Symposium, Pittsburgh, PA, Vol. 108, p. 385.
30. Zeng, K. and Tu, K.N. (2002), “Six cases of reliability study of Pb free solder joints in electronic packaging technology”, Material Science and Engineering, Vol. 38 No. 2, pp. 55-105.
31. Amagai, M. (2008), “A study of nanoparticles in Sn-Ag based lead free solders”, Microelectronics Reliability, Vol. 48 No. 1, pp. 1-16.
32. Chiu, T., Zeng, K., Stierman, R., Edwards, D. and Ano, K. (2004), “Effect of thermal aging on board level drop reliability for Pb-free BGA packages”, Proceedings of 54th Electronics Components and Technology Conference (IEEE, 2004), Las Vegas NV, USA, pp. 1256-62.
33. Gao, F., Cheng, F., Nishikawa, H. and Takemoto, T. (2008), “Characterization of Co-Sn intermetallic compounds in Sn-3.0Ag-0.5Cu-0.5Co lead-free solder alloy”, Materials Letters, Vol. 62 No. 15, pp. 2257-9.
34. Gong, J., Liu, C., Conway, P.P. and Silberschmidt, V. (2006), “Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate”, Acta Materialia, Vol. 56 No. 16, pp. 4291-7.
35. Kim, H.S., Lee, H.J., Yu, Y.S. and Won, Y.S. (2008), “Three-dimensional simulation of intermetallic compound layer growth in a binary alloy system”, Acta Materialia, Vol. 57 No. 4, pp. 1254-62.
36. Kim, Y.S., Kim, K.S., Hwang, C.W. and Sunaguma, K. (2003), “Effect of composition and cooling rate on microstructure and tensile properties of Sn-Zn-Bi alloys”, Journal of Alloys and Compound, Vol. 352 Nos 1-2, pp. 237-45.
37. Kumar, K.M., Kripesh, V. and Tay, A.A.O. (2008), “Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders”, Journal of Alloys and Compounds, Vol. 450 Nos 1-2, pp. 229-237.
38. Lee, J.S., Chu, K.M., Jeon, D.J. and Patzelt, R. (2006), “Formation and characterization of cobalt-reinforced Sn-3.5Ag solder”, Electronic Components and Technology Conference and Proceeding 56th, Institute of Electrical and Electronics Engineers, San Diego, CA, pp. 244-9.
39. Liu, C.M., Ho, C.E., Chen, W.T. and Kao, C.R. (2001), “Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish”, Journal of Electronic Materials, Vol. 30 No. 9, pp. 1152-6.
40. Mayappan, R., Ismail, A.B., Ahmad, Z.A., Ariga, T. and Hussain, L.B. (2007), “Wetting properties of Sn-Pb, Sn-Zn, and Sn-Zn-Bi lead free solder”, Jurnal Teknologi, Vol. 46, pp. 1-13.
41. Suganuma, K. (2001), “Advances in lead-free electronics soldering”, Current Opinion in Solid State and Materials Science, Vol. 5 No. 1, pp. 55-64.
42. Yao, P., Liu, P. and Liu, J. (2008), “Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metallized substrate”, Journal of Alloys and Compounds, Vol. 462 Nos 1-2, pp. 73-79.
43. Yu, J. and Kim, J.Y. (2008), “Effects of residual S on Kirkendall void formation at Cu/Sn-3.5Ag solder joints”, Acta Materialia, Vol. 56 No. 19, pp. 5514-23.