Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads

Journal of Alloys and Compounds

Volumn 509, Issue 5, 2011, Pages 1885-1892

  Fouzder, Tama ^a   Shafiq, Ismathullakhan ^a   Chan, Y C ^a   Sharif, A ^b   Yung, Winco K C ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^c HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Ball grid array solder joints; Microstructure; Nano doping; Shearing force

Indexed keywords

AGING TIME; BALL GRID ARRAY SOLDER JOINTS; CU INTERMETALLICS; DIMPLED SURFACES; DUCTILE FAILURES; FINE MICROSTRUCTURE; FRACTURE SURFACES; INTERFACIAL MICROSTRUCTURE; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC COMPOUNDS; MATRIX; NANO-DOPING; NANO-SIZED; REFLOW CYCLES; SCALLOP-SHAPED; SECOND PHASE; SHEARING FORCE; SMOOTH SURFACE; SNAGCU SOLDER; SOLDER ALLOYS; SOLDER BALLS; SOLDER JOINTS; SRTIO;

BALL GRID ARRAYS; BRITTLE FRACTURE; COPPER ALLOYS; GOLD ALLOYS; INTERMETALLICS; METALLIZING; MICROSTRUCTURE; NANOPARTICLES; SHEAR STRENGTH; SHEARING; SHEARING MACHINES; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; SPHERES; STRONTIUM ALLOYS; TIN ALLOYS;

TIN;

EID: 78651347068     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.10.081     Document Type: Article

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