Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads

Materials and Design

Volumn 50, Issue , 2013, Pages 774-781

  Tsao, L C ^a   Wu, R W ^b   Cheng, Te Hsien ^a   Fan, Kuo Huan ^a   Chen, R S ^b  

^a NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

A. Non ferros metals and alloys; D. Brazing and soldering; F. Microstructure

Indexed keywords

ALUMINUM; BRITTLE FRACTURE; MECHANICAL PROPERTIES; METALLURGY; MICROSTRUCTURE; NANOCOMPOSITES; NANOPARTICLES; SOLDERING; SOLDERING ALLOYS;

BRAZING AND SOLDERING; COMPOSITE SOLDERS; DUCTILE FAILURES; F. MICROSTRUCTURE; FRACTURE SURFACES; INTERFACIAL MICROSTRUCTURE; MICROSTRUCTURE AND MECHANICAL PROPERTIES; NON-FERROS METALS AND ALLOYS;

TIN;

EID: 84876807300     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2013.03.045     Document Type: Article

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