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Volumn 29, Issue , 2012, Pages 48-55

The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads

Author keywords

A. Intermetallics, miscellaneous; B. Phase transformation; C. Heat treatment; D. Microstructure; F. Electron microscopy, scanning

Indexed keywords

ADDITION OF AL; AGING TIME; COMPOSITE SOLDERS; F. ELECTRON MICROSCOPY , SCANNING; HARDNESS VALUES; IMC LAYER; INTERFACIAL MICROSTRUCTURE; INTERMETALLICS , MISCELLANEOUS; KINETIC ANALYSIS; LONG-TIME AGING; ORGANIC SOLDERABILITY PRESERVATIVE; SCALLOP-SHAPED; SN-AG-AL; SNAGCU SOLDER; SOLDER BALLS; SOLDER JOINTS; UNIFORM DISTRIBUTION;

EID: 84863985384     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2012.04.019     Document Type: Article
Times cited : (57)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.