Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

Acta Materialia

Volumn 45, Issue 5, 1997, Pages 1867-1874

  Lee, Byeong Joo ^a   Hwang, Nong Moon ^a   Lee, Hyuck Mo ^b  

^a Korea Research Institute of Standards and Science   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COMPUTATIONAL METHODS; COPPER; EUTECTICS; LIQUID METALS; PHASE DIAGRAMS; PHASE EQUILIBRIA; PHASE INTERFACES; SOLDERING ALLOYS; SUBSTRATES; THERMODYNAMICS; TIN ALLOYS;

LIQUID SOLDERS;

INTERMETALLICS;

EID: 0031139581     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(96)00325-4     Document Type: Article

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