Interfacial reaction issues for lead-free electronic solders

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 155-174

  Ho, C E ^a   Yang, S C ^b   Kao, C R ^c  

^a Michigan State University   (United States)

^b NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^c NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

GROWTH (MATERIALS); PHASE INTERFACES; SOLDERED JOINTS; SPALLING; TIN ALLOYS;

CROSS-INTERACTION; DROP TEST PERFORMANCE; INTERFACIAL REACTIONS;

SOLDERING ALLOYS;

EID: 33845692077     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9031-5     Document Type: Article

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