Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy

Microelectronics Reliability

Volumn 53, Issue 1, 2013, Pages 2-6

  Tu, K N ^a   Hsiao, Hsiang Yao ^b   Chen, Chih ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

EARLY FAILURE; FLIP CHIP SOLDER JOINTS; MICRO-BUMPS; MICROELECTRONIC INDUSTRY;

MICROELECTRONIC PROCESSING; MICROELECTRONICS; MICROSTRUCTURE; THREE DIMENSIONAL COMPUTER GRAPHICS;

ANISOTROPY;

EID: 84872114131     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.07.029     Document Type: Article

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