Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates

Microelectronics Reliability

Volumn 51, Issue 5, 2011, Pages 975-984

  Gain, Asit Kumar ^a   Chan, Y C ^a   Yung, Winco K C ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; FINE MICROSTRUCTURE; HOMOGENEOUS DISTRIBUTION; IMC LAYER; INTERFACIAL MORPHOLOGIES; INTERMETALLIC COMPOUND LAYER; MATRIX; NANO-SIZED; NANO-TIO; REFLOW CYCLES; SCALLOP-SHAPED; SECOND PHASE; SN-AG-CU; SNAGCU SOLDER; SOLDER BALLS; SOLDER JOINTS; THERMAL ANALYSIS; TIO;

DISPERSIONS; HARDNESS; INTERMETALLICS; METALLIZING; MICROSTRUCTURE; NANOPARTICLES; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; THERMOANALYSIS; TIN ALLOYS;

TIN;

EID: 79953662167     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.01.006     Document Type: Article

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