SCOPUS 정보 검색 플랫폼

Cailiao Gongcheng/Journal of Materials Engineering

Volumn , Issue 8, 2009, Pages

Research of new Sn-Ag based lead-free composite solders containing nano-structured reinforcements

(5) Liu, Bin a Tai, Feng a Guo, Fu a Xia, Zhi Dong a Shi, Yao Wu a

a BEIJING UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Mechanical property; Melting characteristic; POSS reinforcement particle; Wettability

Indexed keywords

BINARY ALLOYS; CONTACT ANGLE; MECHANICAL PROPERTIES; MELTING; NANOTECHNOLOGY; PARTICLE REINFORCED COMPOSITES; REINFORCEMENT; WETTING;

COMPOSITE SOLDERS; MASS FRACTION; MELTING CHARACTERISTICS; NANO-STRUCTURED; POLYHEDRAL OLIGOMERIC SILSESQUIOXANES; REINFORCEMENT PARTICLES; SN-3.5AG SOLDERS; WETTING PROPERTY;

LEAD-FREE SOLDERS;

EID: 69249235781 PISSN: 10014381 EISSN: None Source Type: Journal
DOI: None Document Type: Article

Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.