Addition of cobalt nanoparticles into Sn-3.8Ag-0.7Cu lead-free solder by paste mixing

Soldering and Surface Mount Technology

Volumn 23, Issue 1, 2011, Pages 10-14

  Tay, S L ^a   Haseeb, A S M A ^a   Johan, Mohd Rafie ^a  

^a UNIVERSITY OF MALAYA   (Malaysia)

Author keywords

Chemical elements and inorganic compounds; Hardness; Melting point; Solder; Solder paste

Indexed keywords

CHARACTERISTIC PROPERTIES; CO NANOPARTICLES; COBALT NANOPARTICLES; COMPOSITE SOLDERS; DESIGN/METHODOLOGY/APPROACH; HOMOGENEOUS MIXTURES; HOT PLATES; LEAD FREE SOLDERS; NANOCOMPOSITE SOLDER; SN-3.8AG-0.7CU SOLDER; SNAGCU SOLDER; SOLDER; SOLDER PASTE; SPREADING RATE; WEIGHT PERCENTAGES; WETTING ANGLE;

BLENDING; CHEMICAL ELEMENTS; CHEMICALS; COBALT; DIFFERENTIAL SCANNING CALORIMETRY; HARDNESS; INORGANIC COMPOUNDS; MELTING POINT; NANOCOMPOSITES; NANOPARTICLES; SILVER; SOLDERING ALLOYS; WETTING;

TIN;

EID: 79551500033     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911111099659     Document Type: Article

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