Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices

Electronic Materials Letters

Volumn 10, Issue 3, 2014, Pages 645-647

  Zhang, Liang ^a,b   Fan, Xi ying ^a   Guo, Yong huan ^a   He, Cheng wen ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b Engineering IV   (United States)

Author keywords

fatigue life; QFP device; solder joints; thermal cycling loading

Indexed keywords

ALUMINUM; CONCRETE BEAMS AND GIRDERS; MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL CYCLING;

BACK STRESS; MATRIX MICROSTRUCTURE; NANO-AL; QFP DEVICE; QUAD FLAT PACKAGE; SNAGCU SOLDER; SOLDER JOINTS; SOLDER MATRIX;

FATIGUE OF MATERIALS;

EID: 84900019302     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-014-3190-y     Document Type: Article

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