Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging

Journal of Materials Science and Technology

Volumn 28, Issue 1, 2012, Pages 53-59

  Mookam, Niwat ^a   Kanlayasiri, Kannachai ^b  

^a Rajamangala University of Technology Rattanakosin Wang Klai Kangwon Campus   (Thailand)

^b KING MONGKUT'S INSTITUTE OF TECHNOLOGY LADKRABANG   (Thailand)

Author keywords

Activation energy; Intermetallics; Microstructures; Soldering

Indexed keywords

COPPER SUBSTRATES; CU SUBSTRATE; HEXAGONAL LATTICE; INTERMETALLIC PHASE; INTERMETALLIC PHASIS; LATTICE STRUCTURES; LEAD FREE SOLDERS; LITERATURE DATA; ORTHORHOMBIC LATTICES; TEMPERATURE RANGE;

ACTIVATION ENERGY; COPPER; INTERMETALLICS; LEAD COMPOUNDS; MICROSTRUCTURE; SILVER; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; THERMAL AGING;

TIN;

EID: 84856391272     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1005-0302(12)60023-1     Document Type: Article

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