Rate-dependent properties of Sn-Ag-Cu based lead-free solder joints for WLCSP

Microelectronics Reliability

Volumn 50, Issue 4, 2010, Pages 564-576

  Su, Y A ^a   Tan, L B ^a   Tee, T Y ^b   Tan, V B C ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b AMKOR TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SOLDER; ELECTRONIC COMPONENT; EUROPEAN UNION; HIGH STRAIN RATES; INTERFACE FAILURE; INTERFACE STRUCTURES; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDER JOINT; MATERIAL STRENGTH; MECHANICAL PERFORMANCE; MECHANICAL STRENGTH; ON-WAFER; OPERATIONAL RELIABILITY; PEAK LOAD; PORTABLE ELECTRONICS; RATE SENSITIVE; RATE SENSITIVITY; REDISTRIBUTION LAYERS; SILICON-BASED; SN-AG-CU; SN-AG-CU ALLOY; SOLDER ALLOYS; SOLDER BUMP; SOLDER JOINTS; SOLDER-JOINT STRENGTH; TENSILE TESTS; TEST RATE; TEST RESULTS; ULTIMATE TENSILE STRENGTH; UNDER-BUMP METALLURGIES;

ALLOYS; CHIP SCALE PACKAGES; COPPER ALLOYS; DATA STRUCTURES; DUCTILITY; LEAD; MECHANICAL PROPERTIES; PACKAGING; SILICON WAFERS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN RATE; STRESSES; TENSILE STRENGTH; TENSILE TESTING; TESTING; TIN ALLOYS; YIELD STRESS;

TIN;

EID: 77950022162     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.01.043     Document Type: Article

References (12)

1. Frear D., Morgan H., Burchett S., and Lau J. The mechanics of solder alloy interconnects (1999), Chapman & Hall, New York
2. Darveaux R, Reichman C. Ductile-to-brittle transition strain rate. In: Electronics packaging technology conference, EPTC 2006; December 2006. p. 283-89.
3. Henshall Gregory, Healey Robert, Pandher Ranjit S, Sweatman Keith, Howell Keith, Coyle Richard, et al. Inemi Pb-free alloy alternatives project report: state of the industry. In: Surface mount technology association conference; 17 August 2008.
4. Suh D., Kim D.W., Liu P., Kim H., Weninger J.A., Kumar C.M., et al. Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions. Mater Sci Eng A 460-461 July (2007) 595-603
5. Pang J.H.L., and Xiong B.S. Mechanical properties for 95.5Sn-3.8Ag-0.7Cu lead-free solder alloy. IEEE Trans Compon Packag Technol 28 4 (2005) 830-840
6. Che FX, Luan JE, Baraton X. Effect of silver content and nickel dopant on mechanical properties of Sn-Ag-based solders. In: 58th Proceedings of electronic components and technology conference. ECTC 2008; 27-30 May 2008. p. 485-90.
7. Reid M, Punch J, Collins M, Ryan C. Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys. In: 20th Conference on soldering and surface mount technology; 2008. p. 3-8.
8. Darveaux R, Reichman C, Islam N. Interface failure in lead free solder joints. In: 56th Proceedings of electronic components and technology conference. ECTC 2006; 2006. p. 12.
9. Zhao XJ, Caers JFJM, de Vries JWC, Wong EH, Rajoo R. A Component level test method for evaluating the resistance of Pb-free BGA solder joints to brittle fracture under shock impact. In: 57th Proceedings of electronic components and technology conference. ECTC 2007; May 29-June 1 2007. p. 1522-29.
10. Wong EH, Rajoo R, Seah SKW, Selvanayagam CS, van Driel WD, Caers JFJM et al. Correlation studies for component level ball impact shear test and board level drop test. In: Microelectronics reliability, vol. 48, Issue 7, 2007. Reliability of compound semiconductors (ROCS) Workshop; July 2008. p. 1069-78.
11. Newman K. BGA brittle fracture - alternative solder joint integrity test methods. In: 55th Proceedings of electronic components and technology conference. ECTC 2005, vol. 2; 31 May-3 June 2005. p. 1194-201.
12. Kim H, Zhang M, Kumar CM, Suh D, Liu P, Kim D, et al. Improved drop reliability performance with lead free solders of low Ag content and their failure modes. In: 57th Proceedings of electronic components and technology conference. ECTC 2007; May 29-June 1 2007. p. 962-67.