Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples

Journal of Alloys and Compounds

Volumn 473, Issue 1-2, 2009, Pages 382-388

  Zhao, Jie ^a   Cheng, Cong qian ^a   Qi, Lin ^a   Chi, Cheng yu ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Intermetallic; Kinetics; Shear strength; Solder

Indexed keywords

BISMUTH COMPOUNDS; BRAZING; GROWTH KINETICS; LEAD; LEAD COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; WELDING;

AGING PROCESS; AGING TIME; BULK SOLDERS; CU SUBSTRATES; IMC LAYERS; INTERMETALLIC COMPOUND LAYERS; INTERMETALLIC COMPOUNDS; LAYER GROWTHS; LEAD-FREE SOLDER ALLOYS; PROPAGATION RATES; SOLDER;

TIN;

EID: 61449150726     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.05.082     Document Type: Article

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