Interfacial reaction of Sn-Ag-Cu lead-free solder alloy on Cu: A review

Advances in Materials Science and Engineering

Volumn 2013, Issue , 2013, Pages

  Lee, Liu Mei ^a   Mohamad, Ahmad Azmin ^a  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

INTERCONNECT MATERIALS; MINIATURIZATION TECHNOLOGIES; MODERN MICROELECTRONICS; MORPHOLOGY EVOLUTION; SN-AG-CU LEAD-FREE SOLDERS; SN-AG-CU SOLDER ALLOYS; SNAGCU SOLDER; STRUCTURAL PHASIS;

COPPER ALLOYS; COPPER COMPOUNDS; INTERMETALLICS; LEAD; MICROELECTRONICS; SILVER; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84876553516     PISSN: 16878434     EISSN: 16878442     Source Type: Journal    
DOI: 10.1155/2013/123697     Document Type: Review

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