Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads

Microelectronic Engineering

Volumn 86, Issue 10, 2009, Pages 2086-2093

  Das, S K ^a   Sharif, A ^b   Chan, Y C ^a   Wong, N B ^a   Yung, W K C ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY   (Bangladesh)

^c HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

Composite solder; Interfacial reaction; Mechanical property; Micro particle; Sn Zn eutectic solder; Thermal behavior

Indexed keywords

COMPOSITE SOLDER; INTERFACIAL REACTION; MICRO-PARTICLE; SN-ZN EUTECTIC SOLDER; THERMAL BEHAVIOR;

BRAZING; DISSOLUTION; ELECTRONICS PACKAGING; EUTECTICS; GOLD; MECHANICAL PROPERTIES; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; WELDING; ZINC;

TIN;

EID: 67649982586     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.01.087     Document Type: Article

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