Nanoindentation creep behavior of nanocomposite Sn-Ag-Cu solders

Journal of Electronic Materials

Volumn 41, Issue 8, 2012, Pages 2057-2064

  Roshanghias, A ^a   Kokabi, A H ^a   Miyashita, Y ^b   Mutoh, Y ^b   Ihara, I ^b   Guan Fatt, R G ^b   Madaah Hosseini, H R ^a  

^a SHARIF UNIVERSITY OF TECHNOLOGY   (Iran)

^b NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

creep behavior; lead free solders; nanocomposite solders; nanoindentation

Indexed keywords

ACCUMULATIVE ROLL BONDING; CREEP BEHAVIORS; CREEP DEFORMATION MECHANISMS; DEPTH-SENSING NANOINDENTATION; LEAD FREE SOLDERS; NANOCOMPOSITE SOLDER; NANOINDENTATION TECHNIQUES; THERMO-MECHANICAL PERFORMANCE;

CREEP; CREEP RESISTANCE; NANOCOMPOSITES; NANOINDENTATION; REINFORCEMENT; SOLDERING ALLOYS;

TIN;

EID: 84885678322     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-012-2086-6     Document Type: Article

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