SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 31, Issue 8, 2002, Pages 861-867

The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ag

(2) Chen, Kang I a Lin, Kwang Lung a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

DSC; Lead free solder; Mechanical properties; Sn Zn; Sn Zn Ag

Indexed keywords

COMPOSITION EFFECTS; DIFFERENTIAL SCANNING CALORIMETRY; DUCTILITY; FRACTURE; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN MEASUREMENT; TENSILE STRENGTH; X RAY DIFFRACTION ANALYSIS;

ELECTRON PROBE MICROANALYSIS; MELTING POINT; ULTIMATE TENSILE STRENGTH;

SEMICONDUCTING TIN COMPOUNDS;

EID: 0036686543 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-002-0196-2 Document Type: Article

Times cited : (43)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.