Creep and thermomechanical fatigue properties of in situ Cu6Sn5 reinforced lead-free composite solder

Materials Science and Engineering: A

Volumn 527, Issue 15, 2010, Pages 3335-3342

  Tai, F ^a   Guo, F ^a   Han, M T ^a   Xia, Z D ^a   Lei, Y P ^a   Shi, Y W ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Creep; In situ composite solder; Thermomechanical fatigue

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; CREEP RESISTANCE; EUTECTICS; LEAD-FREE SOLDERS; PARTICLE REINFORCED COMPOSITES; SILVER ALLOYS; SOLDERED JOINTS; STRAIN RATE; TIN ALLOYS;

COMPOSITE SOLDER JOINTS; COMPOSITE SOLDERS; CREEP FATIGUE; EUTECTIC SOLDERS; IN SITU COMPOSITE SOLDER; IN-SITU COMPOSITE; REINFORCED COMPOSITES; SN-3.5AG; THERMO MECHANICAL FATIGUES (TMF); THERMOMECHANICAL FATIGUE PROPERTY;

CREEP;

EID: 77950860275     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.02.048     Document Type: Article

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