Interfacial reaction of Sn-9Zn/Cu joint with Cu particle-rein forced composite solder Sn-9Zn

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 28, Issue 5, 2007, Pages 105-108

  Wei, Guoqiang ^a   Kuang, Min ^b   Yang, Yongqiang ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^b GUANGZHOU RESEARCH INSTITUTE OF NON FERROUS METALS   (China)

Author keywords

Composite solder; Interfacial reaction; Lead free solder; Microstructure; Sn 9Zn solder

Indexed keywords

COMPOSITE MATERIALS; ENERGY DISPERSIVE SPECTROSCOPY; INTERMETALLICS; MICROSTRUCTURE; SURFACE CHEMISTRY;

COMPOSITE SOLDER; INTERFACIAL REACTION; INTERMETALLIC COMPOUND (IMC); LEAD FREE SOLDER;

SOLDERING ALLOYS;

EID: 34250720180     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. Katsuaki Suganuma. Advance in lead-free electronics soldering[J]. Current Opinion in Solid State Materials Science, 2001, 5(1): 55-64.
2. Laurila T, Vuorinen V, Kivilahti J K. Interfacial reactions between lead-free solders and common base materials[J]. Materials Science and Engineering R, 2005, 49(1-2): 1-60.
3. Katsuaki Suganuma, Koichi Niihara. Wetting microstmcture between Sn-Zn binary alloys and Cu[J]. Journal of Materials Research, 2002, 13(10): 2859-2865.
4. Vaynman S, Ghosh G, Fine M E. Some fundamental issues in the use of Zn-containing lead-free solders for electronic packaging[J]. Materials Transactions, 2004, 45(3): 630-636.
5. Ikuo Shohji, Takao Nakamura, Fummari Mori, et al. Interface reaction and mechanical properties of lead-free Sn-Zn alloy/Cu joints[J]. Materials Transactions, 2002, 43(8): 1797-1801.
6. Date M, Tu K N. Interfacial reactions and impact reliability of Sn-Zn solder joints on Cu or electroless Au/Ni(P) bond-pads[J]. Journal of Materials Research, 2004, 19(10): 2887-2896.
7. Huang Chia-Wei, Lin Kwang-Lung. Interfacial reactions of lead-free Sn-Zn based solders on Cu and plated electroless Ni-P/Au layer under aging[J]. Journal of Materials Research, 2004, 19(12): 3560-3568.
8. Islam M N, Chan Y C, Rizvi M J, et al. Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder[J]. Journal of Alloys and Compounds, 2005, 400(1-2): 136-144.
9. Yu D Q, Xie H P, Wang L. Investigation of interfacial microstmcture and wetting property of newly developed Sn-Zn-Cu solders with Cu substrate[J]. Journal of Alloys and Compounds, 2004, 385(1-2): 119-125.
10. Tetsu Ichitsubo, Eiichiro Matsubara, Kozo Fujiwara, et al, Control of compound forming reaction at the interface between SnZn solder and Cu substrate[J]. Journal of Alloys and Compounds, 2005, 392(1-2): 200-205.