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Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 10, 2010, Pages 1046-1054

Effect of Y 2O 3 particles on microstructure formation and shear properties of Sn-58Bi solder

(4) Liu, Xiaoying a Huang, Mingliang a Wu, C M L b Wang, Lai a

a DALIAN UNIVERSITY OF TECHNOLOGY (China)

b CITY UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

APPARENT ACTIVATION ENERGY; COMPOSITE SOLDERS; EUTECTIC MICROSTRUCTURE; GROWTH OF INTERMETALLICS; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC COMPOUNDS; LONG-TIME AGING; MICROSTRUCTURE FORMATION; NUCLEATION SITES; REINFORCEMENT PARTICLES; RICH PHASE; SHEAR PROPERTIES; SHEAR TESTS; SOLDER MATRIX; TEMPERATURE RANGE; TIME-PERIODS; WEIGHT PERCENTAGES; WELL-DISPERSED;

ACTIVATION ENERGY; BISMUTH COMPOUNDS; EUTECTICS; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; THERMAL AGING;

TIN;

EID: 77957907906 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-009-0025-y Document Type: Article

Times cited : (62)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.