Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Materials Science and Engineering R: Reports

Volumn 68, Issue 1-2, 2010, Pages 1-38

  Laurila, T ^a   Vuorinen, V ^a   Paulasto Krockel M ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Alloying elements; Diffusion kinetics; Intermetallic compound layers; Lead free solders; Phase diagrams; Thermodynamics

Indexed keywords

ADDITIONAL REACTIONS; ALLOYING EFFECT; BASE SYSTEMS; BINARY PHASIS; DIFFUSION KINETICS; DROP TEST RELIABILITY; ELECTRONICS MANUFACTURING; IMC LAYER; IMPURITY ELEMENT; INTERFACIAL COMPOUNDS; INTERFACIAL REACTION LAYER; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND LAYER; INTERMETALLIC COMPOUNDS; KINETIC METHOD; LEAD FREE SOLDERS; MINOR ALLOYING; PB-FREE; SN-BASED SOLDERS;

ALLOYING; ANTIMONY COMPOUNDS; BISMUTH COMPOUNDS; COBALT COMPOUNDS; GOLD; LEAD; LEAD COMPOUNDS; PALLADIUM; PHASE DIAGRAMS; PHASE INTERFACES; PLATINUM; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING; SOLDERING ALLOYS; THERMODYNAMICS; TIN; ZINC;

ALLOYING ELEMENTS;

EID: 77949490697     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mser.2009.12.001     Document Type: Review

References (211)

1. Kivilahti J.K. JOM 54 12 (2002) 52
2. Mattila T., Marjamäki P., and Kivilahti J.K. IEEE Trans. Compon. Packag. Technol. 29 4 (2006) 787
3. Ho C., Yang S., and Kao C.R. J. Mater. Sci.: Mater. Electron. 18 (2007) 155
4. Ma X., Qian Y., and Yoshida F. J. Alloys Compd. 334 (2002) 224
5. Ohriner E. Weld. J. (1987) 191
6. Wu C.M.L., Yu D.Q., Law C.M.T., and Wang L. Mater. Sci. Eng. R R44 1 (2004) 1
7. Laurila T., Hurtig J., Vuorinen V., and Kivilahti J.K. Microelectron. Reliab. 49 3 (2009) 242
8. Chuang C.-M., and Lin K.-L. J. Electron. Mater. 32 12 (2003) 1426
9. Laurila T., and Vuorinen V. Materials 2 4 (2009) 1796
10. Laurila T., Vuorinen V., and Kivilahti J.K. Mater. Sci. Eng. R49 1-2 (2005) 1
11. Kivilahti J. IEEE Trans. Compon. Packag. Manuf. Technol. 18 (1995) 326
12. Rönkä K., van Loo F., and Kivilahti J. Scripta Mater. 37 10 (1997) 1575
13. Darken L.S., and Gurry R.W. Physical Chemistry of Metals (1953), McGraw-Hill
14. Mattila T., Vuorinen V., and Kivilahti J.K. J. Mater. Res. 19 11 (2004) 3214
15. Gokcen N.A. Thermodynamics (1975), Techscience Incorporated
16. Philibert J. Atom Movements: Diffusion and Mass Transport in Solids (1991), Les Editions de Physique
17. Laurila T., and Molarius J. Crit. Rev. Solid State Mater. Sci. 28 (2003) 185
18. van Loo F.J.J. Prog. Solid State Chem. 20 (1990) 47
19. Shewmon P. Diffusion in Solids. 2nd ed. (1989), TMS
20. Wagner C. Acta Metall. 17 (1969) 99
21. Denbigh K. The Principles of Chemical Equilibrium. 3rd ed. (1978), Cambridge University Press, Cambridge, UK
22. Trimble L.E., Finn D., and Cosgarea Jr. A. Acta Metall. 13 (1965) 501
23. Gruzin P.L. Dokl. Akad. Nauk S.S.S.R. 86 (1952) 289
24. Paul A., Kodentsov A.A., and van Loo F.J.J. J. Alloys Compd. 403 (2005) 147
25. Hillert M. In: Aaronson H. (Ed). Lectures on the Theory of Phase Transformations (1975), AIME
26. Hillert M. Phase Equilibria, Phase Diagrams and Phase Transformations (1998), Cambridge Press
27. Kivilahti J.K., and Kulojärvi K. Proceedings of Design and Reliability of Solders and Solder Interconnections. TMS (1997)
28. Gagliano R., Ghosh G., and Fine M. J. Electron. Mater. 31 11 (2002) 1195
29. Gong J., Liu C., Conway P., and Silberschmidt V. Acta Mater. 56 (2008) 4291
30. Gong J., Liu C., Conway P., and Silberschmidt V. Scripta Mater. 60 (2009) 333
31. P. Oberndorff, Doctoral Dissertation, Eindhoven University of Technology, 2001.
32. Kao C. Mater. Sci. Eng. A238 (1997) 196
33. Hayashi A., Kao C., and Chang Y. Scripta Mater. 37 4 (1997) 393
34. Bernal J. Nature 122 3063 (1928) 54
35. Gangulee A., Das C., and Bever M. Metall. Trans. 4 (1973) 2063
36. Larsson A.-K., Stenberg L., and Lidin S. Acta Crystallogr. B50 (1994) 636
37. Saunders N., and Miodownik A.P. Bull. Alloy Phase Diagr. 11 3 (1990) 278
38. Sang X., Du K., and Ye H. J. Alloys Compd. 469 (2009) 129
39. Tu K.N. Acta Metall. 21 (1973) 347
40. Tu K.N. Mater. Chem. Phys. 46 (1996) 217
41. Tu K.N., and Thompson R. Acta Metall. 30 (1982) 947
42. Bhedwar H., Ray K., Kulkarni S., and Balasubramanian V. Scripta Metall. 6 (1972) 919
43. Revay L. Surf. Technol. 5 (1977) 57
44. Onishi M., and Fujibuchi H. Trans. Jpn. Inst. Metals 16 (1975) 539
45. Mei Z., Sunwoo A., and Morris J. Metall. Trans. 23A (1992) 857
46. M. Oh, Doctoral Dissertation, Leigh University, 1994.
47. A. Paul, Doctoral Dissertation, Technical University of Eindhoven, 2004.
48. Zeng K., Stierman R., Chiu T.-C., Edwards D., Ano K., and Tu K.N. J. Appl. Phys. 97 2 (2005) 4508
49. van Dal M.J.H., Gusak A.M., Cserhati C., Kodentsov A.A., and van Loo F.J.J. Phys. Rev. Lett. 86 (2001) 3352
50. van Dal M.J.H., Gusak A.M., Cserhati C., Kodentsov A.A., and van Loo F.J.J. Phil. Mag. A 82 (2002) 943
51. Kim J., and Yu J. Appl. Phys. Lett. 92 9 (2008) 2109
52. Bader W. Weld. J. 48 12 (1969) 551
53. Bader W. Proc. Conf. Physical Metall. Metal Joining. St. Louis, MO, TMS/AIME, Warrendale, USA, October 16-17 (1980)
54. Mei Z., Eslambochi A., and Johnsson P. Proc. 48th Electronic Components and Tech. Conf. IEEE, Piscataway, NJ (1998) 952
55. Minor A., and Morris J. Metall. Mater. Trans. 31A (2000) 798
56. Laurila T., Vuorinen V., Mattila T., and Kivilahti J.K. J. Electron. Mater. 34 1 (2005) 103
57. Laurila T., Vuorinen V., and Kivilahti J.K. Mater. Sci. Semicond. Process. 7 (2004) 307
58. Ho C., Tsai R., Lin Y., and Kao C.R. J. Electron. Mater. 31 6 (2002) 584
59. Ho C., Lin Y., and Kao C.R. Chem. Mater. 14 (2002) 949
60. Hwang C.W., Suganuma K., Kiso M., and Hashimoto S. J. Mater. Res. 18 11 (2003) 2540
61. Matsuki H., Ibuka H., and Saka H. Sci. Technol. Adv. Mater. 3 (2002) 261
62. Vuorinen V., Laurila T., Yu H., and Kivilahti J.K. J. Appl. Phys. 99 2 (2006) 3530
63. Amagai M. Microelectron. Reliab. 48 (2008) 1
64. Gao F., Takemoto T., and Nishikawa H. Mater. Sci. Eng. A A420 (2006) 39
65. Nogita K., and Nishimura T. Scripta Mater. 59 (2008) 191
66. Xu L., and Pang J. Thin Solid Films 504 (2006) 362
67. Vuorinen V., Laurila T., Mattila T., Heikinheimo E., and Kivilahti J.K. J. Electron. Mater. 36 10 (2007) 1355
68. Lin C.-H., Chen S.-W., and Wang C.-H. J. Electron. Mater. 31 (2002) 907
69. Schmetterer C., Flandorfer H., Luef Ch., Kodentsov A., and Ipser H. J. Electron. Mater. 38 1 (2009) 10
70. Gupta K.P. J. Phase Equilb. 21 5 (2000) 479
71. V. Vuorinen, T.M. Korhonen, J.K. Kivilahti, Helsinki Univ. of Tech. Internal Report, HUT-EPT-4, ISBN 951-22-5629-0 (2001).
72. Yu H., Vuorinen V., and Kivilahti J.K. The Proceedings of the 2006 IEEE/EIA CPMT Electronic Component and Technology Conference (ECTC'06). San Diego, CA, USA, May 29-June 1 (2006)
73. Yu C., Liu J., Lu H., Li P., and Chen J. Intermetallics 15 (2007) 1471
74. van Loo F.J.J., Pieraggi B., and Rapp R. Acta Metall. Mater. 38 9 (1990) 1769
75. Vuorinen V., Yu H., Laurila T., and Kivilahti J.K. J. Electron. Mater. 37 6 (2008) 792
76. Korhonen T.M., Hong S.J., Su P., and Korhonen M.A. Proceedings of the 2000 SMTA International Conference. Chicago, IL, September 24-28 (2000)
77. Thwaites C. Electroplat. Metal Finish. 26 8 (1973) 10
78. Thwaites C. Electroplat. Metal Finish. 26 8 (1973) 21
79. Duckett R., and Ackroyd M. Electroplat. Metal Finish. 29 5 (1976) 13
80. Jacobson D., and Humpston G. Gold Bull. 22 1 (1989) 9
81. Park J.-Y., Kabade R., Kim C.-U., Carper T., Dunford S., and Puligandla V. J. Electron. Mater. 32 12 (2003) 1474
82. Marcotte V., and Schroeder K. MRS Symp. Proc. 19 (1983) 403
83. IPMA. The Thermodynamic Databank for Interconnection and Packaging Materials (2009), Helsinki University of Technology, Helsinki
84. J. Roeder, Doctoral Dissertation, Lehigh University, 1988.
85. Zakel E., Azdasht G., and Reichl H. IEEE Trans. Compon. Hybrid Manuf. Technol. 4 (1991) 672
86. Karlsen O., Kjekshus A., and Rost E. Acta Chem. Scand. (Denmark) 46 2 (1992) 147
87. Yeung B., and Jang J.-W. J. Mater. Sci. Lett. 21 9 (2002) 732
88. Wade N., Wu K., Kunii J.J.J., Yamada S., and Miyahara K. J. Electron. Mater. 30 9 (2001) 1228
89. Li G., Chen B., Shi X., Wong S., and Wang Z. Thin Solid Films 504 (2006) 421
90. Li G., Chen B., and Tey J. IEEE Trans. Electron. Packag. Manuf. 27 1 (2004) 77
91. Rai R., Kang S., and Purushothaman S. Proceedings of the 45th Electronic Components and Technology Conference. Las Vegas, NV, USA, May 21-24 (1995) 1197
92. Chen B., and Li G. Thin Solid Films 462-463 (2004) 395
93. Barkov A., Laajoki K., Gornostayev S., Pakhomosvkii Y., and Menshikov Y. Am. Mineral. 83 (1998) 901
94. Tomlinson W., and Cooper G. J. Mater. Sci. 21 (1986) 1730
95. Lee C., Lin C.-Y., and Yen Y.-W. Intermetallics 15 (2007) 1027
96. Jiang J., Tsao S., Sullivan T., Razeghi M., and Brown G. Infrared Phys. Technol. 45 (2004) 143
97. Korhonen T., and Kivilahti J. J. Electron. Mater. 27 3 (1998) 149
98. Drapala J., Kozelkova R., Vodarek V., Kubicek P., Vrestal J., and Kroupa A. Acta Metall. Slovaca 13 4 (2007) 642
99. Moser Z., Sebo P., Gasior W., Svec P., and Pstrus J. CALPHAD 33 (2009) 63
100. Jendrzejczyk-Handzlik D., Gierlotka W., and Fitzner K. J. Chem. Thermodyn. 41 (2009) 250
101. Popovic A., and Bencze L. Int. J. Mass Spectrom. 257 (2006) 41
102. Sharif A., and Chan Y. J. Alloys Compd. 390 (2005) 67
103. Keene B. Int. Mater. Rev. 38 4 (1993) 157
104. Miedema A. Z. Metall. 69 (1978) 287
105. Utigard T. Z. Metall. 84 11 (1993) 792
106. Liu X., Inohana Y., Ohnuma I., Kainuma R., Ishida K., Moser Z., Gasior W., and Pstrus J. J. Electron. Mater. 31 (2002) 1139
107. Nicholas M., Valentine T., and Waite M. J. Mater. Sci. 15 (1980) 2197
108. Sebo P., Svec P., Janickovic D., and Stefanik P. J. Alloys Compd. 463 (2008) 168
109. Laurila T., Mattila T., Vuorinen V., Karppinen J., Li J., Sippola M., and Kivilahti J.K. Microelectron. Reliab. 47 7 (2007) 1135
110. Amagai M., Toyoda Y., Ohnishi T., and Akita S. Proceedings of the 54th Electronics Components and Technology Conference, vol. 2. June 1-4 (2004) 1304
111. Andersson C., Sun P., and Liu J. J. Alloys Compd. 457 (2008) 97
112. Liu L., Andersson C., and Liu J. J. Electron. Mater. 33 9 (2004) 935
113. Cheng F., Gao F., Nishikawa H., and Takemoto T. J. Alloys Compd. 472 (2009) 530
114. Foley J.C., Gickler A., Leprevost F.H., and Brown D. J. Electron. Mater. 29 10 (2000) 1258
115. Anderson I.E., Foley J.C., Cook B.A., Harringa J., Terpstra R.L., and Unal O. J. Electron. Mater. 30 9 (2001) 1050
116. Guo-kui J., Xi-Cheng W., Peng S., and Liu J. Solder. Surf. Mount Technol. 20 3 (2008) 4
117. Anderson I., Foley J., Cook B., Harringa J., Terpstra R., and Unal O. J. Electron. Mater. 30 9 (2001) 1050
118. Anderson I., and Harringa J. J. Electron. Mater. 35 1 (2006) 94
119. Wang S., and Liu C. Acta Mater. 55 (2007) 3327
120. Wang S., Dougherty J., Huebner W., and Pepin J. J. Am. Ceram. Soc. 77 12 (1994) 3051
121. Ghosh G. J. Appl. Phys. 88 (2000) 6887
122. Ghosh G. Acta Mater. 48 14 (2000) 3719
123. Ghosh G. J. Electron. Mater. 33 10 (2004) 1080
124. Sharma G., Eichfeld C., and Mohney S. J. Electron. Mater. 32 11 (2003) 1209
125. Sharma G., and Kripesh V. 56th Electronic Components and Technology Conference (ECTC). San Diego, USA (2006) 190
126. Chen W.T., Ho C.E., and Kao C.R. J. Mater. Res. 17 2 (2002) 263
127. Ho C.E., Lin Y.L., Yang S.C., Kao C.R., and Jiang D.S. J. Electron. Mater. 35 5 (2006) 1017
128. Hirose A., Fujii T., Imamura T., and Kobayashi K. Mater. Trans. 42 5 (2002) 794
129. Takemoto T., and Yamamoto T. J. JCBRA 40 1 (2001) 309
130. Suganuma K., and Kim K.-S. J. Mater. Sci.: Mater. Electron. 18 (2007) 121
131. Chang T.-C., Wang M.-C., and Hon M.-H. J. Cryst. Growth 250 (2003) 236
132. Sun P., Andersson C., Wei X., Cheng Z., Shangguan D., and Liu J. J. Alloys Compd. 437 (2007) 169
133. Liu Y., Wan J., and Gao Z. J. Alloys Compd. 465 (2008) 205
134. Lee C.-Y., Yoon J.-W., Kim Y.-J., and Jung S.-B. Microelectron. Eng. 82 (2005) 561
135. Duan L., Yu D., Han S., Ma H., and Wang L. J. Alloys Compd. 381 (2004) 202
136. Islam M., Chan Y., Rizvi M., and Jillek W. J. Alloys Compd. 400 (2005) 136
137. Wang F.-J., Gao F., Ma X., and Qian Y.-Y. J. Electron. Mater. 35 10 (2006) 1818
138. Chen X., Li M., Ren X., Hu A., and Mao D. J. Electron. Mater. 35 9 (2006) 1734
139. Wang F., Ma X., and Qian Y. Scripta Mater. 53 (2005) 699
140. DeSousa I., Henderson D., Patry L., Kang S., and Shih D.-Y. 56th Electronic Components and Technology Conference (ECTC). San Diego, USA (2006) 1454
141. Wang F.-J., Yu Z.-S., and Qi K. J. Alloys Compd. 438 1-2 (2007) 110
142. Chou C.-Y., and Chen S.-W. Acta Mater. 54 (2006) 2393
143. Huang Y.-C., Chen S.-W., Chou C.-Y., and Gierlotka W. J. Alloys Compd. 477 1-2 (2009) 283
144. Ershova T., Kamenetskaya D., and Ilina L. Izv. Akad. Nauk. SSSR Met. 4 (1981) 201
145. Nishitani S., Ishihara K., Suzuki R., and Shingu P. J. Mater. Sci. Lett. 4 (1985) 872
146. The SGTE Databank for Solutions and Substances (released at 8.1.1992).
147. Dinsdale A.T. CALPHAD 15 (1991) 317
148. Mackay C., and von Voss W. Mater. Sci. Technol. 1 3 (1985) 240
149. Mei Z., and Morris J. J. Electron. Mater. 21 6 (1992) 599
150. Raeder C., Felton L., Tanzi V., and Knorr D. J. Electron. Mater. 23 7 (1994) 611
151. Tanabe T., and Asaki S. J. Mining Mater. Process. Inst. Jpn. (Japan) 113 3 (1997) 205
152. Miao H., and Duh J. Mater. Chem. Phys. 71 3 (2001) 255
153. Li J., Mannan S., Clode M., Whalley D., and Hutt D. Acta Mater. 54 11 (2006) 2907
154. Hwang C., and Suganuma K. Mater. Sci. Eng. A A373 1-2 (2004) 187
155. Hwang J. Solder. Surf. Mount Technol. 14 8 (2000) 20
156. Kivilahti J., and Savolainen P. J. Electron. Manuf. 5 4 (1995) 245
157. Kattner U., and Boettinger W. J. Electron. Mater. 23 (1994) 603
158. D. Kim, Doctoral Thesis, Cornell University, 1996.
159. Suh M.-S., Park C.-J., and Kwon H.-S. Mater. Chem. Phys. 110 (2008) 95
160. Rönkä K., van Loo F.J.J., and Kivilahti J.K. Metall. Mater. Trans. A 29A (1998) 2951
161. Liu P., and Shang J. Scripta Mater. 44 (2001) 1019
162. Keene B.J. Int. Mater. Rev. 38 4 (1993) 157
163. Liu P., and Shang J. Scripta Mater. 53 (2005) 631
164. Shang P., Liu Z., Li D., and Shang J. Scripta Mater. 58 (2008) 409
165. Hirth J., Pieraggi B., and Rapp R. Acta Metall. 43 (1995) 1065
166. Yoon J.-W., and Jung S.-B. J. Alloys Compd. 359 (2003) 202
167. Harris P., and Chaggar K. Solder. Surf. Mount Technol. 10 3 (1998) 38
168. Pratt R., Stromswold E., and Quesnel D. IEEE Trans. Comp. Pack. Manuf. Tech. Part A 19 1 (1996) 134
169. Vianco P., Hopkins P., Erickson K., Frear D., and Davidson R. In: Mahidhara R., Frear D., Sastry S., Murty K., Liaw P., and Winterbottom W. (Eds). Design and Reliability of Solders and Solder Interconnections (1997), The Minerals, Metals and Materials Society 161
170. Holloway K., and Fryer P. Appl. Phys. Lett. 57 (1990) 1736
171. Holloway K., Fryer P., Cabral C., Harper J., Bailey P., and Kelleher K. J. Appl. Phys. 71 (1992) 5433
172. Moon K.-W., Boettinger W.J., Kattner U.R., Biancanielo F.S., and Handwerker C.A. J. Electron. Mater. 29 10 (2000) 1122
173. Ohnuma I., Miyashita M., Anzai K., Liu X.J., Ohtani H., Kainuma R., and Ishida K. J. Electron. Mater. 29 10 (2000) 1137
174. Ahat S., Sheng M., and Luo L. J. Electron. Mater. 30 10 (2001) 1317
175. Dariavach N., Callahan P., Liang J., and Fournelle R. J. Electron. Mater. 35 7 (2007) 1581
176. Yu D., Wang L., Wu C., and Law C. J. Alloys Compd. 389 (2005) 153
177. Liang J., Dariavach N., and Shangguan D. In: Suhir E., Lee Y., and Wong C.P. (Eds). Micro- and Optoelectronic Materials and Structures vol. 1 (2007), Springer, USA
178. Bae K., and Kim S. J. Electron. Mater. 30 11 (2001) 1452
179. Choubey A., Yu H., Osterman M., Pecht M., Yun F., Younghong L., and Ming X. J. Electron. Mater. 37 8 (2008) 1130
180. Zhou H., and Zheng J. Acta Metall. Sin. 23 1 (1987) 39
181. Liu N.-S., and Lin K.-L. J. Alloys Compd. 456 (2008) 466
182. Chuang C.-M., Hung H.-T., Liu P.-C., and Lin K.-L. J. Electron. Mater. 33 1 (2004) 7
183. Huang B., Hwang H.-S., and Lee N.-C. 57th Electronic Components and Technology Conference (ECTC). San Diego, USA (2006) 184
184. Ma J., Chen G., Li X., Tananka T., and Tang J. 7th International Conference on Electronic Packaging Technology, 2006. ICEPT'06 (2006) 1
185. Yoon J.-W., Kim S.-W., and Jung S.-B. J. Alloys Compd. 385 (2004) 192
186. Hang S.J., Kao H.J., and Liu C.Y. J. Electron. Mater. 33 10 (2004) 1130
187. Kim S.-W., Yoon J.-W., and Jung S.-B. J. Electron. Mater. 33 10 (2004) 1182
188. He M., Chen Z., and Qi G. Acta Mater. 52 (2004) 2047
189. He M., Chen Z., Qi G., Wong C.C., and Mhaisalkar S.G. Thin Solid Films 462-463 (2004) 363
190. He M., Kumar A., Yeo P.T., Qi G.J., and Chen Z. Thin Solid Films 462-463 (2004) 387
191. Alam M.O., Chan Y.C., and Tu K.N. J. Appl. Phys. 94 6 (2003) 4108
192. Young B.-L., Duh J.-G., and Jang G.-Y. J. Electron. Mater 32 12 (2003) 1463
193. Alam M.O., Chan Y.C., and Hung K.C. Microelectron. Reliab. 42 (2002) 1065
194. Jeon Y.-D., Paik K.-W., Bok K.-S., Choi W.-S., and Cho C.-L. J. Electron. Mater. 31 5 (2002) 520
195. Liu P.L., and Shang J.K. Metall. Mater. Trans. A 31A (2000) 2867
196. Takemoto T., Okamoto I., and Matsumura J. Q. J. Jpn. Weld. Soc. 5 1 (1987) 81
197. Xia X., Xie X., and Lu C. J. Mater. Sci. 41 (2006) 2359
198. Law C.M., Wu C.M., Yu D., Wang L., and Lai J. J. Electron. Mater. 35 1 (2006) 89
199. Wu C.M., Yu D., Law C.M., and Wang L. J. Mater. Res. 31 9 (2002) 3146
200. Wu C.M., and Wong Y. J. Mater. Sci.: Mater. Electron. 18 (2007) 77
201. Wu C.M., Yu D., Law C.M., and Wang L. J. Electron. Mater. 31 9 (2002) 928
202. Yu D., Zhao J., and Wang L. J. Alloys Compd. 376 (2004) 170
203. Riani P., Mazzone D., Zanicchi G., Marazza R., and Ferro R. Intermetallics 5 (1997) 507
204. Hao H., Shi Y., Xia Z., Lei Y., and Guo F. J. Electron. Mater. 37 1 (2008) 2
205. Senkovska I., Mudryk Y., Romaka L., and Bodak O. J. Alloys Compd. 312 (2000) 124
206. Zhang X., Zhan Y., Guo Q., Zhang G., and Hu J. J. Alloys Compd. 480 2 (2009) 382
207. Kim K., Huh S., and Suganuma K. Microelectron. Reliab. 43 (2003) 259
208. Huttunen-Saarivirta E. Surf. Coat. Technol. 160 (2002) 288
209. Brugger R. Nickel Plating: A Comprehensive Review of Theory, Practise, Properties and Applications Including Cobalt Plating (1970), Ropert Draper, England
210. Alajoki M., Nguyen L., and Kivilahti J.K. Proceedings of the Electronic Component and Technology Conference (ECTC'05). Orlando, FL, USA, May 31-June 3 (2005) 637
211. Wang Y., Lin Y., and Kao C.R. Microelectron. Reliab. 49 (2009) 248