Effects of rare earths on properties and microstructures of lead-free solder alloys

Journal of Materials Science: Materials in Electronics

Volumn 20, Issue 8, 2009, Pages 685-694

  Zhang, Liang ^a   Xue, Song Bai ^a   Gao, Li Li ^a   Zeng, Guang ^a   Sheng, Zhong ^a   Chen, Yan ^b   Yu, Sheng Lin ^a,c  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP STRENGTHS; CREEP-RUPTURE; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; PHYSICAL BEHAVIORS; PROPERTIES AND MICROSTRUCTURES; ROOM TEMPERATURE; SOLDER JOINTS; TRACE AMOUNTS;

ALLOYS; BRAZING; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; COPPER ALLOYS; CREEP; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; SOLDERING ALLOYS; WELDING;

RARE EARTHS;

EID: 67349099560     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9895-2     Document Type: Review

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