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Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 8, 2013, Pages 2976-2988

Thermal analysis and mechanical properties of Sn-1.0Ag-0.5Cu solder alloy after modification with SiC nano-sized particles

(4) El Daly, A A a Fawzy, A b Mansour, S F a Younis, M J c

a Zagazig University (Egypt)

b Ain Shams University (Egypt)

c ISLAMIC UNIVERSITY OF GAZA (Palestine)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; NANO-SIZED PARTICLES; SIC NANOPARTICLES; SOLDERING PROCESS; SOLIDIFIED STRUCTURES; STRONG DISPERSION; THERMAL BEHAVIORS; ULTIMATE TENSILE STRENGTH;

ALLOYS; COPPER ALLOYS; MECHANICAL PROPERTIES; NANOPARTICLES; PARTICLE SIZE; SILICON CARBIDE; SILVER; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TENSILE STRENGTH; THERMOANALYSIS; TIN ALLOYS;

TIN;

EID: 84881481349 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-013-1200-8 Document Type: Article

Times cited : (74)

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