Finite element analysis of SnAgCu(Zn, Co, Fe) lead-free solder joints for electronic packaging

International Journal of Nonlinear Sciences and Numerical Simulation

Volumn 15, Issue 3-4, 2014, Pages 197-206

  Zhang, Liang ^a   Cui, Jun Hua ^b   Han, Ji Guang ^a   He, Cheng Wen ^a   Guo, Yong Huan ^a   Yuan, Jian Min ^a  

^a JIANGSU NORMAL UNIVERSITY   (China)

^b NAVAL AERONAUTICAL AND ASTRONAUTICAL UNIVERSITY   (China)

Author keywords

Fatigue life; Inelastic deformation; Lead free solders; Uniaxial tension

Indexed keywords

EID: 84903630945     PISSN: 15651339     EISSN: None     Source Type: Journal    
DOI: 10.1515/ijnsns-2012-0063     Document Type: Article

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