SCOPUS 정보 검색 플랫폼

Journal of Alloys and Compounds

Volumn 510, Issue 1, 2011, Pages 38-45

Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging

(5) Zhang, Liang a,b Xue, Song Bai a Zeng, Guang a Gao, Li Li a Ye, Huan a

a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS (China)

b JIANGSU NORMAL UNIVERSITY (China)

Author keywords

Growth kinetics; Intermetallic compound; Rare earth; Thermal cycling

Indexed keywords

AGING CONDITIONS; AGING TIME; CU SUBSTRATE; INTERFACE REACTIONS; INTERMETALLIC COMPOUND; INTERMETALLIC COMPOUND LAYER; ISOTHERMAL AGING; SNAGCU SOLDER; TRACE AMOUNTS;

CERIUM ALLOYS; GROWTH KINETICS; INTERMETALLICS; RARE EARTHS; REACTION KINETICS; THERMAL CYCLING;

SOLDERING ALLOYS;

EID: 80054060821 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2011.08.044 Document Type: Article

Times cited : (124)

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