Influence of Temperature on Creep Behavior of Ag Particle Enhancement SnCu Based Composite Solder

Tsinghua Science and Technology

Volumn 12, Issue 3, 2007, Pages 296-301

  Yan, Yanfu ^a   Feng, Lifang ^a   Zhang, Keke ^a   Wen, Jiuba ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

99.3Sn0.7Cu; composite solder; creep rupture life; particle enhancement

Indexed keywords

COMPOSITE SOLDERS; CREEP RUPTURE LIFE; EUTECTIC SOLDER;

CREEP; CREEP RESISTANCE; PARTICLES (PARTICULATE MATTER); SOLDERED JOINTS; THERMAL EFFECTS; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 34447532358     PISSN: 10070214     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1007-0214(07)70044-5     Document Type: Article

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