A reliability study of nanoparticles reinforced composite lead-free solder

Materials Transactions

Volumn 51, Issue 10, 2010, Pages 1720-1726

  Chen, Si ^a   Zhang, Lili ^a   Liu, Johan ^a,b   Gao, Yulai ^a   Zhai, Qijie ^a  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

Composite solder; Fracture mode; Nanoparticles; Shear strength; Thermal cycling

Indexed keywords

BEFORE AND AFTER; CHIP RESISTOR; COMPOSITE SOLDERS; CRACK INITIATION AND PROPAGATION; CU NANOPARTICLES; DIRECT CURRENT; ELECTROLESS NICKEL IMMERSION GOLD; FRACTURE MODE; FRACTURE SURFACES; LEAD FREE SOLDERS; LOW MELTING POINT; OPTICAL MICROSCOPES; REINFORCED COMPOSITES; SCANNING ELECTRON MICROSCOPES; SHEAR TESTS; SN-3.0AG-0.5CU; SOLDER JOINTS; SOLDER MATRIX; SOLDER PASTE; SURFACE FINISHES; TEMPERATURE RANGE; THERMAL CYCLE; THERMOMECHANICAL FATIGUE; TRANSMISSION ELECTRON MICROSCOPE;

CRACKS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRON MICROSCOPES; FRACTURE; NANOPARTICLES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TESTING; THERMAL CONDUCTIVITY; THERMAL CYCLING; TRANSMISSION ELECTRON MICROSCOPY;

TIN;

EID: 78649358122     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MJ201002     Document Type: Article

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