SCOPUS 정보 검색 플랫폼

Volumn 19, Issue 4, 2008, Pages 349-356

Creep property of composite solders reinforced by nano-sized particles

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDERS; CREEP RUPTURE LIFE;

CREEP RESISTANCE; METALLIC MATRIX COMPOSITES; NANOPARTICLES; SHEAR STRENGTH; STRESS CONCENTRATION; TENSILE STRENGTH; VOLUME FRACTION;

SOLDERING ALLOYS;

EID: 39149108174 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-007-9327-0 Document Type: Article

Times cited : (55)

References (13)

1
- 0026403451
- J.L. Marshall, J. Calderon, J. Sees, G. Lucey, J.S. Hwang, Hybrid Manuf. Technol. 14(4), 698 (1991)
- (1991) Hybrid Manuf. Technol. , vol.14 , Issue.4 , pp. 698
- Marshall, J.L.¹ Calderon, J.² Sees, J.³ Lucey, G.⁴ Hwang, J.S.⁵

2
- 0035008111
- F. Guo, J.P. Lucas, K.N. Subramanian, J. Mat. Sci.: Mat. Electron. 12(1), 27 (2001)
- (2001) J. Mat. Sci.: Mat. Electron. , vol.12 , Issue.1 , pp. 27
- Guo, F.¹ Lucas, J.P.² Subramanian, K.N.³

3
- 0035455149
- F. Guo, J. Lee, S. Choi, J.P. Lucas, T.R. Bieler, K.N. Subramanian, J. Electron. Mat. 30(9), 1073 (2001)
- (2001) J. Electron. Mat. , vol.30 , Issue.9 , pp. 1073
- Guo, F.¹ Lee, J.² Choi, S.³ Lucas, J.P.⁴ Bieler, T.R.⁵ Subramanian, K.N.⁶

4
- 33845586481
- in 30 May-2 June
- J.S. Lee, K.M. Chu, D.Y. Jeon, R. Patzelt, D. Manessis, A. Ostmann, in Proceedings of the 56th Electronic Components and Technology Conference, IEEE, 244-249, 30 May-2 June (2006)
- (2006) Proceedings of the 56th Electronic Components and Technology Conference, IEEE , pp. 244-249
- Lee, J.S.¹ Chu, K.M.² Jeon, D.Y.³ Patzelt, R.⁴ Manessis, D.⁵ Ostmann, A.⁶

5
- 0032206792
- H. Mavoori, S. Jin, J. Electron. Mat. 27(11), 1216 (1998)
- (1998) J. Electron. Mat. , vol.27 , Issue.11 , pp. 1216
- Mavoori, H.¹ Jin, S.²

6
- 28444449853
- K. Mohankumar, A.A.O. Tay, in Proceedings of 6th Electronics Packaging Technology Conference, IEEE, 455-461 (2004)
- (2004) Proceedings of 6th Electronics Packaging Technology Conference, IEEE , pp. 455-461
- Mohankumar, K.¹ Tay, A.A.O.²

7
- 4944261402
- J.P. Liu, F. Guo, Y.F. Yan, W.B. Wang, Y.W. Shi, J. Electron. Mat. 33(9), 958 (2004)
- (2004) J. Electron. Mat. , vol.33 , Issue.9 , pp. 958
- Liu, J.P.¹ Guo, F.² Yan, Y.F.³ Wang, W.B.⁴ Shi, Y.W.⁵

8
- 1842482031
- D.C. Lin, C.Y. Kuo, T.S. Srivatsan, G.X. Wang, in Proceedings of the ASME Heat Transfer Division-2003 vol 3: Heat Transfer Equipment, Heat Transfer in Manufacturing and Materials Processing, Visualization of Heat Transfer, 253-258 (2003)
- (2003) Proceedings of the ASME Heat Transfer Division-2003 Vol 3: Heat Transfer Equipment, Heat Transfer in Manufacturing and Materials Processing, Visualization of Heat Transfer , pp. 253-258
- Lin, D.C.¹ Kuo, C.Y.² Srivatsan, T.S.³ Wang, G.X.⁴

9
- 33644910140
- S.M.L. Nai, J. Wei, M. Gupta, Thin Solid Films 504(1-2), 401 (2006)
- (2006) Thin Solid Films , vol.504 , Issue.1-2 , pp. 401
- Nai, S.M.L.¹ Wei, J.² Gupta, M.³

10
- 28044453784
- A. Lee, K.N. Subramanian, J. Electron. Mat. 34(11), 1399 (2005)
- (2005) J. Electron. Mat. , vol.34 , Issue.11 , pp. 1399
- Lee, A.¹ Subramanian, K.N.²

11
- 33845708252
- F. Guo, J Mat. Sci.: Mat. Electron. 18(1-3), 129 (2007)
- (2007) J Mat. Sci.: Mat. Electron. , vol.18 , Issue.1-3 , pp. 129
- Guo, F.¹

12
- 0021439364
- Y.W. Shi, J.T. Barnby, Int. J. Fracture 25(2), 143 (1984)
- (1984) Int. J. Fracture , vol.25 , Issue.2 , pp. 143
- Shi, Y.W.¹ Barnby, J.T.²

13
- 0025841402
- Y.W. Shi, J.T. Barnby, A.S. Nadkarni, Eng. Fracture Mech. 39(1), 37 (1991)
- (1991) Eng. Fracture Mech. , vol.39 , Issue.1 , pp. 37
- Shi, Y.W.¹ Barnby, J.T.² Nadkarni, A.S.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.