Investigation preparation method and soldering behaviors of Sn-58Bi lead-free solder with carbon nanotubes

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 32, Issue 9, 2011, Pages 9-12

  He, Peng ^a   An, Jing ^a   Ma, Xin ^b   Chen, Sheng ^b   Qian, Yiyu ^a   Lin, Tiesong ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Yik Shing Tat Industrial Co Ltd   (China)

Author keywords

Ball milling; Carbon nanotubes; Low temperature melting; Sn 58Bi solder

Indexed keywords

DISPERSIVE DISTRIBUTION; FRACTURE MECHANISMS; LEAD FREE SOLDERS; LOW TEMPERATURE MELTING; PREPARATION METHOD; PULL-OFF; SN-58BI SOLDER; SOLDER ALLOYS; SOLDER JOINTS; WEIGHT FRACTIONS;

ALLOYS; BALL MILLING; MELTING; MILLING (MACHINING); MULTIWALLED CARBON NANOTUBES (MWCN); SOLDERING; TIN ALLOYS;

TIN;

EID: 80053999856     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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