Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn-Zn lead-free solder

Intermetallics

Volumn 18, Issue 4, 2010, Pages 730-735

  Mayappan, Ramani ^a   Ahmad, Zainal Arifin ^b  

^a UNIVERSITI TEKNOLOGI MARA   (Malaysia)

^b SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

Author keywords

A. Intermetallic, miscellaneous; B. Phase transformations; C. Crystal growth; C. Heat treatment; F. Electron microscopy, scanning

Indexed keywords

B. PHASE TRANSFORMATIONS; C. CRYSTAL GROWTH; F. ELECTRON MICROSCOPY , SCANNING; INTERMETALLIC , MISCELLANEOUS; PHASE TRANSFORMATION;

ACTIVATION ENERGY; CRYSTAL GROWTH; CRYSTALLIZATION; GRAIN BOUNDARIES; GROWTH KINETICS; HEAT TREATMENT; INTERMETALLICS; LEAD; MORPHOLOGY; PHASE INTERFACES; PHASE TRANSITIONS; SCANNING; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; THICKNESS MEASUREMENT; ZINC;

TIN;

EID: 77349084832     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2009.11.016     Document Type: Article

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