The effect of cooling rate on the dendritic spacing and morphology of Ag3Sn intermetallic particles of a SnAg solder alloy

Materials and Design

Volumn 32, Issue 5, 2011, Pages 3008-3012

  Garcia, Leonardo R ^a   Osório, Wislei R ^a   Garcia, Amauri ^a  

^a UNIVERSITY OF CAMPINAS   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

AS CAST MICROSTRUCTURE; COOLING RATES; DENDRITIC SPACINGS; EUTECTIC MIXTURE; INTER-METALLIC PARTICLE; INTERDENDRITIC REGIONS; INTERMETALLIC COMPOUNDS; MATRIX; MECHANICAL STRENGTH; SECONDARY DENDRITE ARM SPACING; SLOW COOLING; SN-AG SOLDER; SOLDER ALLOYS; SOLDER JOINTS;

COOLING; INTERMETALLICS; LOW CARBON STEEL; MICROSTRUCTURE; MIXTURES; MORPHOLOGY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS;

TIN;

EID: 79952190913     PISSN: 02641275     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matdes.2010.12.046     Document Type: Article

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