Development of Sn-Zn lead-free solders bearing alloying elements

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 1, 2010, Pages 1-15

  Zhang, Liang ^a   Xue, Song Bai ^a   Gao, Li Li ^a   Sheng, Zhong ^a   Ye, Huan ^a   Xiao, Zheng Xiang ^a   Zeng, Guang ^a   Chen, Yan ^b   Yu, Sheng Lin ^a,c  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b HARBIN WELDING INSTITUTE   (China)

^c CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP PROPERTIES; EUTECTIC ALLOYS; HIGH TEMPERATURE OXIDATION RESISTANCE; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; MELTING BEHAVIOR; SN-ZN SOLDER; SOLDERING TEMPERATURE;

ALLOYING; ALLOYING ELEMENTS; CHROMIUM; GALLIUM; GALLIUM ALLOYS; GERMANIUM; INTERMETALLICS; LEAD; LEAD COMPOUNDS; MECHANICAL PROPERTIES; OXIDATION; OXIDATION RESISTANCE; SILVER; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS; ZINC;

TIN;

EID: 77949424798     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-0014-1     Document Type: Review

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