Development of nano-composite lead-free electronic solders

Journal of Electronic Materials

Volumn 34, Issue 11, 2005, Pages 1399-1407

  Lee, Andre ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

Lead free electronic solders; Nano technology; Polyhedral oligomeric silsesquioxanes (POSS) Service reliability

Indexed keywords

METALLIC COMPOUNDS; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; TEMPERATURE DISTRIBUTION; WETTING;

LEAD-FREE ELECTRONIC SOLDERS; METALLIC MATERIALS; POLYHEDRAL OLIGOMERIC SILSEQUIXONES (POSS) SERVICE RELIABILITY;

SOLDERING ALLOYS;

EID: 28044453784     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0197-z     Document Type: Article

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